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How does the PCB reflect the 3W and 20H principles? What is the difference between signal lines?
Release on 2020-03-16It is easy to reflect in the PCB design. It is enough to ensure that the distance between the center of the trace and the trace is 3 times the line width. For example, the line width of the trace is 6mil.Read More
Is the bottom layer copper good for PCB?
Release on 2020-03-14In the process of PCB design, some engineers do not want to lay copper on the entire surface of the bottom layer in order to save time. Is this right? Is it necessary for the PCB to be copper-plated?Read More
PCBA shielding mold wave soldering process technology
Release on 2020-03-13Because traditional wave soldering technology cannot cope with the welding of fine-pitch and high-density chip components on the welding surface, a new method has emerged..Read More
PCB failure analysis technology (3)
Release on 2020-03-12Due to the development trend of high-density PCBs and environmental protection requirements of lead-free and halogen-free, more and more PCBs have encountered various failure problems such as poor wetting, bursting, delamination, and CAF.Read More
PCB failure analysis technology (2)
Release on 2020-03-11In the analysis of PCBs, the energy spectrometer is mainly used for the component analysis of the surface of the pad, and the element analysis of the contamination on the surface of the pad and the lead pin with poor solderability.Read More
PCB failure analysis technology (1)
Release on 2020-03-10For this kind of failure problem, we need to use some commonly used failure analysis techniques to ensure the quality and reliability of the PCB during the manufacturing process to a certain degree of assurance. Summarize the failure analysis techniques for reference.Read More
IC substitution techniques in PCB circuit design
Release on 2020-03-09When you need to replace ICs in PCB circuit design, here are the tips to replace ICs to help designers be more perfect in PCB circuit design.Read More
What spacing requirements do I need to pay attention to in my PCB design?
Release on 2020-03-07We will encounter a variety of safety clearance issues in ordinary PCB design, such as the distance between vias and pads, the distance between traces and traces, etc.Read More
Causes of blistering after SMA soldering and open or false soldering of IC pins
Release on 2020-03-06After SMA welding, nail-sized bubbles appear, the main reason is that water vapor is trapped inside the PCB substrate, especially the processing of multilayer boards.Read More
SMT wave soldering quality defects and solutions
Release on 2020-03-05Tipping refers to the occurrence of excess needle solder at the end of the solder joint, which is a unique defect in the wave soldering process.Read More
Solutions for SMT wicking and bridging defects
Release on 2020-03-04The core pulling phenomenon is one of the common soldering defects, which is more common in gas phase reflow soldering. The wicking phenomenon causes the solder to leave the pad and travel along the pin to between the pin and the chip body, which usually forms a serious false soldering phenomenon.Read More
Causes and Solutions of SMT Tin Beads
Release on 2020-03-03Tin bead is one of the common defects in reflow soldering. It not only affects the appearance but also causes bridging. Tin bead can be divided into two types.Read More
SMT monument phenomenon-quality defects in reflow welding and solutions
Release on 2020-03-02In the reflow soldering phenomenon, chip components often stand up.Cause: The root cause of the monument phenomenon is that the wetting forces on the two sides of the component are unbalanced, so the torque at both ends of the element is not balanced, which leads to the occurrence of the monument phenomenon.Read More
Factors affecting the quality of reflow soldering by SMT chip
Release on 2020-02-28The quality of reflow soldering is affected by many factors, the most important factor is the temperature curve of the reflow soldering furnace and the composition parameters of the solder paste.Read More
SMT patch quality analysis
Release on 2020-02-27Common quality problems of SMT patches are missing parts, side parts, flip parts, offsets, and damaged parts.Read More
SMT solder paste printing quality analysis
Release on 2020-02-26There are several common quality problems caused by poor printing of solder paste:
1.Insufficient solder paste (local lack or even overall lack) will lead to insufficient solder amount of the component solder joints after the soldering, open components, and component misalignment and vertical componentsRead More
SMT quality problems: common defects and solutions in the point glue process
Release on 2020-02-25Wire drawing / Drag tail is a common defect in point glue, and the common causes are: the inside diameter of the nozzle is too small, the point glue pressure is too high..Read More
PCBA Process Introduction
Release on 2020-02-24PCBA, Printed Circuit Board Assembly, this is a technology mature industry, printed circuit board assembly; also called SMT, Surface Mounting Technology, surface mount technology.Read More
Ten Difficulties of PCB Circuit Board Proof Design
Release on 2020-02-221.PCB proofing process level is not clear:The single-panel design is in the TOP layer. If you do not specify the pros and cons, you may make a board and install the device instead of soldering.Read More
PCB and circuit anti-interference measures
Release on 2020-02-21The anti-interference problem is a very important link in modern circuit design. It directly reflects the performance and reliability of the entire system. For PCB engineers, anti-interference design is the focus and difficulty that everyone must master.Read More