|
Item |
Standard |
Advanced |
|
Minimum Line/Spacing, Internal |
3/3 |
3/3 |
|
Minimum Line/Spacing, External |
4/4 |
3/3 |
|
Minimum Drilled Hole Size |
8 |
6 |
|
Aspect Ratio (Thickness to Drill) |
10:1 |
15:1 |
|
Annular Ring (Diameter over Drill) |
10 |
8 |
|
Anti-pad (Diameter over Drill) |
20 |
16 |
|
Plated Hole Tolerance |
±3 |
±2 |
|
Minimum Dielectric Thickness |
3 |
2 |
|
Maximum PCB Thickness (inches) |
0.200 |
0.250 |
|
Thickness Tolerance (% of Thickness) |
±10 |
±7 |
|
Maximum PCB Dimensions (inches) |
16.0 X 22.0 |
30.0 X 44.0 |
|
Fabricated Dimensions – NC Routing |
±5 mils |
±3 mils |
|
Layer-to-Layer Registration Tolerance |
±5 |
±3 |
|
Solder Mask Clearance, Per Side |
2.0 mils |
1.5 mils |
|
Blind/Buried Vias (All Types) |
yes |
yes |
|
Via Fill (Conductive, Non-Conductive) |
yes |
yes |
|
Inner Layers |
Standard |
Advance |
|
Minimum Core thickness |
3 mils |
2 mils |
|
Minimum Line width |
4 mils |
3 mils (H Oz copper) |
|
Minimum Spacing (Air gap) |
4 mils |
3 mils (H Oz copper) |
|
Minimum pad size |
Drill size+10 mils |
Drill Size+7 mils |
|
Minimum Anti Pad (planes) |
Drill Size+20 mils |
Drill Size+16 mils |