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Pcb Assembly Service Retains Most Enhancements in Smaller Form Factor Raspberry Pi 3 Model A+Pcb Assembly Service Retains Most Enhancements in Smaller Form Factor Raspberry Pi 3 Model A+Pcb Assembly Service Retains Most Enhancements in Smaller Form Factor Raspberry Pi 3 Model A+Pcb Assembly Service Retains Most Enhancements in Smaller Form Factor Raspberry Pi 3 Model A+Pcb Assembly Service Retains Most Enhancements in Smaller Form Factor Raspberry Pi 3 Model A+Pcb Assembly Service Retains Most Enhancements in Smaller Form Factor Raspberry Pi 3 Model A+

Pcb Assembly Service Retains Most Enhancements in Smaller Form Factor Raspberry Pi 3 Model A+

  • Type:Raspberry Pi 3 Model B
  • Chipset:Raspberry Pi 3 Model B
  • Place of Origin:Guangdong, China
  • Model Number:NO
  • Application:iot
  • Product name:2GB RAM Raspberry Pi 4 Model B
  • Usage:OEM Electronics
  • Certificate:ROSH. ISO9001
  • Solder mask:Green. Red. Blue. White. Black.Yellow
  • Service:One Stop Turkey Service
 Welcome to O-leading

O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly ,We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production.

In general, our global customers are very impressed with our services:Rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. 

Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.

PLEASE CLICK THESE FOR MORE INFORMATION:Circuit Board Electronic PCB Assembly Factory

 Product Description

Raspberry Pi 3 Model A+, With Most Enhancements As Raspberry Pi 3B+, In Smaller Form Factor, And Lower Price ( Professional Rigid Flexible PCB Supplier for Raspberry Pi )


By halving the RAM to 512MB, and removing the USB hub and Ethernet controller, Raspberry Pi 3 Model A+ is able to become smaller
in size, and hit a lower price point.
Raspberry Pi 3 Model A+ incorporates most of the neat enhancements as its big brother Raspberry Pi 3B+, and features:
* A 1.4GHz 64-bit quad-core ARM Cortex-A53 CPU
* Dual-band 802.11ac wireless LAN and Bluetooth 4.2/BLE
* Improved USB mass-storage booting
* Improved thermal management

Like its big brother, the entire board is certified as a radio module under FCC rules, which in turn will significantly reduce the cost of conformance testing Raspberry Pi–based products.


* Broadcom BCM2837B0, Cortex-A53 (ARMv8) 64-bit SoC @ 1.4GHz
* 2.4GHz and 5GHz IEEE 802.11.b/g/n/ac wireless LAN, Bluetooth 4.2/BLE
* No Ethernet port
* Extended 40-pin GPIO header
* Full-size HDMI
* Single USB 2.0 port
* CSI camera port for connecting a Raspberry Pi Camera Module
* DSI display port for connecting a Raspberry Pi Touch Display
* 4-pole stereo output and composite video port
* Micro SD port for loading your operating system and storing data
* 5V/2.5A DC power input

Our Team


 Process Capability
PCB Production Capabilities
 Layer Count  1Layer-32Layer
 Finished copper thickness  1/3oz-12oz
 Min Line width/spacing internal  3.0mil/3.0mil
 Min Line width/spacing external
 Max Aspect Ratio  10:1
 Board thickness  0.2mm-5.0mm
 Max Panel size(inches)  635*1500mm
 Minimum Drilled Hole Size  4mil 
 PIated Hole Tolerance    +/-3mil
 BIind/Buried Vias (AII Types)  YES
 Via Fill(Conductive,Non-Conductive)  YES 
 Base Material  FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,Heavy Copper
 Surface finishes  HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink
SMT Production Capabilities
 PCB Material     FR-4,CEM-1,CEM-3,Aluminum-based board,FPC
 Max PCB size   510x1500mm
 Min PCB size   50x50mm
 PCB Thickness    0.5mm-4.5mm
 Board thickness  0.5-4mm
 Min Components size   0201
 Standard chip size component     
 0603 and larger
 Component max height  15mm 
 Min lead pitch  0.3mm
 Min BGA ball pitch  0.4mm
 Placement precision  +/-0.03mm

Packaging & Delivery


1. How do O-Leading ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
1.4.Dedicated quality assurance team with failure case analysis process
1.5.Continuous staff training and education

2. How do O-Leading keep your price competitive?
Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled or quadrupled; Chinese currency RMB had appreciated 31% over US dollar; And our labor cost also increased significantly.
However, O-Leading have kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes and improving efficiency. Our prices are very competitive in the industry at the same quality level.
We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an edgeon cost and quality.

3. What kinds of boards can O-Leading process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

4. What data are needed for PCB & PCBA production?
4.1 BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
4.2 PCB Gerber files.
4.3 PCB fabrication drawing and PCBA assembly drawing.
4.4 Test procedures.
4.5 Any mechanical restrictions such as assembly height requirements.

5. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

6. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
The equipments we have are the best in the industry, laser drilling machines are from Mitsubishi and Hitachi, LDI machines are from Screen(Japan), Automatic Exposing machines are also from Hitachi, all of them make we can meet customer’s technical requirements.

7. How many types of surface finish O-lead can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

8. What’s your capability for FPC? Can O-Leading provide SMT service also?
O-Leading can fabricate FPC from single layer to 8layer, the working panel size can be as large as 2000mm*240mm, please find the details in the page “Flex Capability”
We also provide SMT one stop service to customer.

9. What are the main factors which will affect the price of PCB?
Surface finish;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
Different manufacturing countries.

10. What’s the definition of PCB, PWB and FPC and what’s the difference?
PCB is short for Printed Circuit Board;
PWB is short for Printed Wire Board, same meaning as Printed Circuit Board;
FPC is short for Flexible Printed Board.

11. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.

12. What’s the merits of O-leading's rIgid-flex PCB?
O-leading’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.

13. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.


Contact Person:Mrs.Fancy

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