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Via-In-Pad

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COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED This PN required 10% impedance, 8mil laser drill, POFV, stacked via, laser bl...More
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China Base Material Megtron 6, used for 100G CFP (Optical module), high frequency PCB, Immersion Ag, blind/buried via holes factory

Base Material Megtron 6, used for 100G CFP (Optical module), high frequency PCB, Immersion Ag, blind/buried via holes

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED This PN required 10% impedance, 8mil laser drill, POFV, stacked via, laser bl...More
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