Home > Category > Special tech PCB > Via-In-Pad > Base Material Megtron 6, used for 100G CFP (Optical module), high frequency PCB, Immersion Ag, blind/buried via holes
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Base Material Megtron 6, used for 100G CFP (Optical module), high frequency PCB, Immersion Ag, blind/buried via holesBase Material Megtron 6, used for 100G CFP (Optical module), high frequency PCB, Immersion Ag, blind/buried via holes

Base Material Megtron 6, used for 100G CFP (Optical module), high frequency PCB, Immersion Ag, blind/buried via holes

  • Product Nature
  • Layer count: 10L 2+(6)+2
  • materials:  Megtron 6
  • Board thickness: 1.6+/-0.16mm
  • Surface finish: ENIG
  • Special : 10% impedance, 8mil laser drill, POFV, stacked via, laser blind via drill thru 6mil dielectric  and plug and plating flat via
  • Application: 100G CFP (Optical module)
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
This PN required 10% impedance, 8mil laser drill, POFV, stacked via, laser blind via drill thru 6mil dielectric  and plug and plating flat via

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity  indicator card on top side

Layer structure






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