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- 전자 앨범
Base Material Megtron 6, used for 100G CFP (Optical module), high frequency PCB, Immersion Ag, blind/buried via holes
- Product Nature
- Layer count: 10L 2+(6)+2
- materials: Megtron 6
- Board thickness: 1.6+/-0.16mm
- Surface finish: ENIG
- Special : 10% impedance, 8mil laser drill, POFV, stacked via, laser blind via drill thru 6mil dielectric and plug and plating flat via
- Application: 100G CFP (Optical module)
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
This PN required 10% impedance, 8mil laser drill, POFV, stacked via, laser blind via drill thru 6mil dielectric and plug and plating flat via
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
This PN required 10% impedance, 8mil laser drill, POFV, stacked via, laser blind via drill thru 6mil dielectric and plug and plating flat via
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
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