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- Release on2020-06-05
- HDI board (High Density Interconnector), that is, high-density interconnector, is a circuit board with a relatively high line distribution density usi......Read More>>
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- Release on2020-06-04
- PCB (Printed Circuit Board), abbreviated as printed board, is one of the important components in the electronics industry. Almost every electronic de......Read More>>
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- Release on2020-06-03
- A wide variety of automotive PCBs Automobiles are a complex of machinery and electronic equipment. Modern automotive technology brings together ancie......Read More>>
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- Release on2020-06-02
- Before designing a multi-layer PCB circuit board, the designer needs to first determine the structure of the circuit board used according to the circu......Read More>>
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- Release on2020-03-16
- It is easy to reflect in the PCB design. It is enough to ensure that the distance between the center of the trace and the trace is 3 times the line width. For example, the line width of the trace is 6mil....Read More>>
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- Release on2020-03-14
- In the process of PCB design, some engineers do not want to lay copper on the entire surface of the bottom layer in order to save time. Is this right? Is it necessary for the PCB to be copper-plated?...Read More>>
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- Release on2020-03-13
- Because traditional wave soldering technology cannot cope with the welding of fine-pitch and high-density chip components on the welding surface, a new method has emerged.....Read More>>
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- Release on2020-03-12
- Due to the development trend of high-density PCBs and environmental protection requirements of lead-free and halogen-free, more and more PCBs have encountered various failure problems such as poor wetting, bursting, delamination, and CAF....Read More>>
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- Release on2020-03-11
- In the analysis of PCBs, the energy spectrometer is mainly used for the component analysis of the surface of the pad, and the element analysis of the contamination on the surface of the pad and the lead pin with poor solderability....Read More>>
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- Release on2020-03-10
- For this kind of failure problem, we need to use some commonly used failure analysis techniques to ensure the quality and reliability of the PCB during the manufacturing process to a certain degree of assurance. Summarize the failure analysis techniques for reference....Read More>>
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- Release on2020-03-09
- When you need to replace ICs in PCB circuit design, here are the tips to replace ICs to help designers be more perfect in PCB circuit design....Read More>>
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- Release on2020-03-07
- We will encounter a variety of safety clearance issues in ordinary PCB design, such as the distance between vias and pads, the distance between traces and traces, etc....Read More>>
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- Release on2020-03-06
- After SMA welding, nail-sized bubbles appear, the main reason is that water vapor is trapped inside the PCB substrate, especially the processing of multilayer boards....Read More>>
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- Release on2020-03-05
- Tipping refers to the occurrence of excess needle solder at the end of the solder joint, which is a unique defect in the wave soldering process....Read More>>
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- Release on2020-03-04
- The core pulling phenomenon is one of the common soldering defects, which is more common in gas phase reflow soldering. The wicking phenomenon causes the solder to leave the pad and travel along the pin to between the pin and the chip body, which usually forms a serious false soldering phenomenon....Read More>>
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- Release on2020-03-03
- Tin bead is one of the common defects in reflow soldering. It not only affects the appearance but also causes bridging. Tin bead can be divided into two types....Read More>>
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- Release on2020-03-02
- In the reflow soldering phenomenon, chip components often stand up.Cause: The root cause of the monument phenomenon is that the wetting forces on the two sides of the component are unbalanced, so the torque at both ends of the element is not balanced, which leads to the occurrence of the monument phenomenon....Read More>>
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- Release on2020-02-28
- The quality of reflow soldering is affected by many factors, the most important factor is the temperature curve of the reflow soldering furnace and the composition parameters of the solder paste....Read More>>
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- Release on2020-02-27
- Common quality problems of SMT patches are missing parts, side parts, flip parts, offsets, and damaged parts....Read More>>
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- Release on2020-02-26
- There are several common quality problems caused by poor printing of solder paste:
1.Insufficient solder paste (local lack or even overall lack) will lead to insufficient solder amount of the component solder joints after the soldering, open components, and component misalignment and vertical components...Read More>>
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