SMT patch quality analysis
Common quality problems of SMT patches are missing parts, side parts, flip parts, offsets, and damaged parts.
The main factors leading to missing pieces
1.The component feeder is not feeding properly.
2.The air path of the component nozzle is blocked, the nozzle is damaged, and the height of the nozzle is incorrect.
3.The vacuum gas path of the equipment is faulty and blocked.
4.The circuit board is poorly received and deformed.
5.There is no solder paste or too little solder paste on the pads of the circuit board.
6.The quality of components is inconsistent.
7.The mounting program of the placement machine has errors or omissions, or the wrong selection of component thickness parameters during programming.
8.Human factors accidentally knocked off.
Main factors that cause flip and side pieces of SMC resistors
1.The component feeder is feeding abnormally.
2.The height of the nozzle of the placement head is incorrect.
3.The height of the head is not correct.
4.The size of the loading hole of the component tape is too large, and the component is turned over due to vibration.
5.The direction of the bulk material is reversed when it is put into the braid.
The main factors that cause component placement
1.The X-Y coordinate of the component is incorrect when programming the placement machine.
2.The reason of the patch nozzle makes the suction unstable.
The main factors that cause damage during component placement
1.The positioning thimble is too high, making the position of the circuit board too high, and the components are squeezed during placement.
2.When programming the placement machine, the Z-axis coordinates of the components are incorrect.
3.The nozzle spring of the placement head is stuck.