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Screen Printing Bending Ink wholesales, PCB Assembly manufacturer chinaScreen Printing Bending Ink wholesales, PCB Assembly manufacturer chinaScreen Printing Bending Ink wholesales, PCB Assembly manufacturer china

Screen Printing Bending Ink wholesales, PCB Assembly manufacturer china

  • Layers: 2 
  • Material: FR4
  • Finished Thickness: 1.57mm +/- 10% 
  • Outer Layer Copper Thickness: 1oz
  • Finish: ENIG (Au:2-5u")
  • Soldermask (Color): Both Sides, LPI (Black)
  • Silkscreen (Color): Both Sides, White
Welcome to O-leading

We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time. 


Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity  indicator card on top side

PLEASE CLICK THESE FOR MORE INFORMATION:Multilayer board manufacturer china

 Product Description
Quick Details
Place of Origin Guang dong, China (Mainland) Brand Name O-Leading
Base Material FR-4,,Aluminum Copper Thickness 0.5oz-5oz
Min. Hole Size 0.2mm Min. Line Width 0.2mm
Surface Finishing immersion gold ,OSP,lead free HASL Board Thickness
applicable to led,mobile phone,air conditioners,washing machines character Industrial Control pcb
certificates ISO9001,UL,RoHS,SGS Q/CTN: 10PCS-100PCS
weight 0.01kg -5kg MOQ: 10pcs
color blue ,red ,green,black.yellow  Min. Line Spacing  0.2mm 
Model Number  power bank pcb assembly pcba manufacturer  price  $0.1-$10 
desigh type  client requirement  size  0.01m3-10m3 

Production Capability
16 years professional OEM pcb board manufacture(PCB Assembly manufacturer china )
 item   2014    2015~2016   2017~2018
 Volume  Sample  Volume  Sample  Volume  Sample
 Layer count  32  42  38  44  42  48
 Min Line/space (μm)  50/50  40/45  40/45  40/40  35/40  35/35
 Min drill hole
diameter (mm)
 0.15  0.10  0.15  0.10  0.15  0.10
 Aspect ratio 
of PTH
 14:1  16:1  16:1  18:1  18:1  20:1
 N+C+N  4+C+4  5+C+5  5+C+5  6+C+6  5+C+5  6+C+6
 Any layer interconnection  5+2+5  6+2+6  5+2+5  6+2+6  5+2+5  6+2+6
 Plate filling via  YES  --  YES  --  YES  --
 Min. core thickness (exclude copper) (μm)  50  40 40  30 40  30 
 Min. Laser Drill diameter (μm)  75  65  65  50  50  40
 Via on buried 
hole/stacked via
 YES  --  YES  --  YES  --
 Material       FR4, Megtron, Nelco, Rogers, Heavy Copper, etc.
 Embedded capacitor PCB  YES  --  YES  --  YES  --
 Surface Process Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin,
 Flash gold, Gold finger plating,  Selective hard gold plating, 
Peelable solder mask, Carbon ink      

Our Team


Packaging & Delivery

 Process Capability

PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external:  4.0mil/4.0mil
Max Aspect Ratio:  10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches):  635*1500mm
Minimum Drilled Hole Size:  4mil
PIated Hole Tolerance:  +/-3mil
BIind/Buried Vias (AII Types):  YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
              Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

SMT Production Capabilities
PCB Material:  FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component:  0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision:  +/-0.03mm



Contact Person:Mrs.Fancy


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