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Email: sales@o-leading.com
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Screen Printing Bending Ink wholesales, PCB Assembly manufacturer china
- Layers: 2
- Material: FR4
- Finished Thickness: 1.57mm +/- 10%
- Outer Layer Copper Thickness: 1oz
- Finish: ENIG (Au:2-5u")
- Soldermask (Color): Both Sides, LPI (Black)
- Silkscreen (Color): Both Sides, White
| Welcome to O-leading |
We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time.
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
PLEASE CLICK THESE FOR MORE INFORMATION：Multilayer board manufacturer china
| Product Description |
Quick Details
| Place of Origin | Guang dong, China (Mainland) | Brand Name | O-Leading |
| Base Material | FR-4,,Aluminum | Copper Thickness | 0.5oz-5oz |
| Min. Hole Size | 0.2mm | Min. Line Width | 0.2mm |
| Surface Finishing | immersion gold ,OSP,lead free HASL | Board Thickness |
0.1-5mm |
| applicable to | led,mobile phone,air conditioners,washing machines | character | Industrial Control pcb |
| certificates | ISO9001,UL,RoHS,SGS | Q/CTN: | 10PCS-100PCS |
| weight | 0.01kg -5kg | MOQ: | 10pcs |
| color | blue ,red ,green,black.yellow | Min. Line Spacing | 0.2mm |
| Model Number | power bank pcb assembly pcba manufacturer | price | $0.1-$10 |
| desigh type | client requirement | size | 0.01m3-10m3 |
Production Capability
16 years professional OEM pcb board manufacture(PCB Assembly manufacturer china )
| item | 2014 | 2015~2016 | 2017~2018 | |||
| Volume | Sample | Volume | Sample | Volume | Sample | |
| Layer count | 32 | 42 | 38 | 44 | 42 | 48 |
| Min Line/space (μm) | 50/50 | 40/45 | 40/45 | 40/40 | 35/40 | 35/35 |
| Min drill hole diameter (mm) |
0.15 | 0.10 | 0.15 | 0.10 | 0.15 | 0.10 |
| Aspect ratio of PTH |
14:1 | 16:1 | 16:1 | 18:1 | 18:1 | 20:1 |
| N+C+N | 4+C+4 | 5+C+5 | 5+C+5 | 6+C+6 | 5+C+5 | 6+C+6 |
| Any layer interconnection | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 |
| Plate filling via | YES | -- | YES | -- | YES | -- |
| Min. core thickness (exclude copper) (μm) | 50 | 40 | 40 | 30 | 40 | 30 |
| Min. Laser Drill diameter (μm) | 75 | 65 | 65 | 50 | 50 | 40 |
| Via on buried hole/stacked via |
YES | -- | YES | -- | YES | -- |
| Material | FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. | |||||
| Embedded capacitor PCB | YES | -- | YES | -- | YES | -- |
| Surface Process | Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, Peelable solder mask, Carbon ink |
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| Our Team |
| Certifications |
| Packaging & Delivery |
| Process Capability |
PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink
SMT Production Capabilities
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
Tag:
Double-side
,led pcb
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