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Single Side PCB manufacturer china , Ultra-thin PCB manufacturer china , Single PCB manufacturer china
- PCB P/N:CD539
- Layer Count:2L
- Material:FR-4 TG130
- Board thk:0.8mm
- copper thk:2/2oz
- Smallest hole size:0.5MM
- No. of holes (pcs):477
- line w/s:12/12mil
- Impedance control. Y / N (Tol %):N
- Surface Finishing:HASL-LF
- Solder Mask Silkscreen: White / N/A
- Single board size:Dim X (mm):301;Dim Y (mm):75.8
- Panelisation:Dim X (mm):320;Dim Y (mm):240;No Of UPS:3
- Special:peelable mask:N
- Routing/Punching:CNC
| Welcome to O-leading |
O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production.
In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward.
Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.PCB Assembly manufacturer china
| Product Description |
Quick Details
| PCB P/N | CD539 |
| Layer Count | 2L |
| Material | FR-4 TG130 |
| Board thk | 0.8mm |
| copper thk | 2/2oz |
| Smallest hole size | 0.5mm |
| No. of holes (pcs) | 477 |
| line w/s | 12/12mil |
| Impedance control. Y / N (Tol %) | N |
| Surface Finishing | HASL-LF |
| Solder Mask Silkscreen | White / N/A |
| Single board size | Dim X (mm):301; Dim Y (mm):75.8 |
| Panelisation | Dim X (mm):320; Dim Y (mm):240;No Of UPS:3 |
| Special:peelable mask | N |
| Routing/Punching | CNC |
Production Capability
16 years professional OEM pcb board manufacture(PCB layout manufacturer china)
| item | 2014 | 2015~2016 | 2017~2018 | |||
| Volume | Sample | Volume | Sample | Volume | Sample | |
| Layer count | 32 | 42 | 38 | 44 | 42 | 48 |
| Min Line/space(μm) | 50/50 | 40/45 | 40/45 | 40/40 | 35/40 | 35/35 |
| Min drill hole diameter (mm) | 0.15 | 0.10 | 0.15 | 0.10 | 0.15 | 0.10 |
| Aspect ratio of PTH | 14:1 | 16:1 | 16:1 | 18:1 | 18:1 | 20:1 |
| N+C+N | 4+C+4 | 5+C+5 | 5+C+5 | 6+C+6 | 5+C+5 | 6+C+6 |
| Any layer interconnection | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 |
| Plate filling via | YES | -- | YES | -- | YES | -- |
| Min. core thickness (exclude copper) (μm) | 50 | 40 | 40 | 30 | 40 | 30 |
| Min. Laser Drill diameter (μm) | 75 | 65 | 65 | 50 | 50 | 40 |
| Via on buried hole/stacked via | YES | -- | YES | -- | YES | -- |
| Material | FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. | |||||
| Embedded capacitor PCB | YES | -- | YES | -- | YES | -- |
| Surface Process | Lead-free HASL, ENIG,OSP, Immersion silver,Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating,Peelable solder mask,Carbon ink | |||||
| Our Team |
| Certifications |
| Packaging & Delivery |
| Process Capability |
PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink
SMT Production Capabilities
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
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