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Double Side PCB manufacturer china, Mobile Phone PCB supplier china , Impedance PCB manufacturer china
- PCB P/N:0310303500E
- Layer Count:2L
- Material:FR-4 TG130
- Board thk:0.8mm
- copper thk:1/1oz
- Smallest hole size:0.2MM
- No. of holes (pcs):23
- line w/s:8/8mil
- Impedance control. Y / N (Tol %):N
| Welcome to O-leading |
O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. （Impedance PCB manufacturer china ）
In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward.
Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.
| Product Description |
| PCB P/N | 0310303500E |
| Layer Count | 2L |
| Material | FR-4 TG130 |
| Board thk | 0.8mm |
| copper thk | 1/1oz |
| Smallest hole size | 0.2mm |
| No. of holes (pcs) | 23 |
| line w/s | 8/8mil |
| Impedance control. Y / N (Tol %) | N |
| Surface Finishing | ENIG Au:0.05-0.10UM |
| Solder Mask Silkscreen | Green/ n/a |
| Single board size | Dim X (mm):139; Dim Y (mm):75 |
| Panelisation | Dim X (mm):236.5;Dim Y (mm):137.2;No Of UPS:4 |
| Special | N |
| Routing/Punching | CNC |
| Our Team |
| Certifications |
| Packaging & Delivery |
| Process Capability |
PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink
SMT Production Capabilities
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
Tag:
Double-side
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