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Base Material M7NE, used for 25Gbps Backplane Project, high frequency PCB, Immersion Gold, blind/buried via holes, press fit holes, Impedance control
- Layer count: 48L
- materials: M7NE
- Board thickness: 8.0+/-0.8mm
- Finishing Size: 870x500mm
- Min Line w/s: 5/5mil
- Min drill size [FHS/DHS] : 0.34mm/0.45mm
- Plating AR DHS : 18:1
- Surface finish: ENIG
- Structure: 1+N+2+N+1
- Other : Press fit blind via hole
- Impedance Tol: +/-8%
- Press fit hole location Tol: +/- 1mil (At one connecter)
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
Special requirement:ENIG, Impedance: Tol: +/-7%, Press fit hole
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
Special requirement:ENIG, Impedance: Tol: +/-7%, Press fit hole
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
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