- Browse Categories
- Hot products(235)
- Multilayer PCB(130)
- Double-side pcb(100)
- single layer pcb(5)
- PCB Application Fields(32)
- 3D printer PCB(13)
- Controller PCB(4)
- Automotive PCB(12)
- Boys sensor(3)
- PCB Brand(21)
- Philips PCB(2)
- SOCOMEC PCB(2)
- Magana PCB(2)
- Emerson PCB(4)
- EBM PCB(5)
- BCE PCB(2)
- ESBI PCB(4)
- Special Material PCB(51)
- Special tech PCB(47)
- Carbon Printed PCB(3)
- Plug Via holes(6)
- Via-In-Pad(3)
- Peelable Mask(3)
- Sink holes(17)
- Edge Plating(10)
- Hard Gold PCB(5)
- Development Board(4)
- HDI PCB(25)
- PCBA(55)
- Rigid-Flexible PCB(36)
- Ceramic and Matel Base pcb(25)
- Contact us
- TEL: + 86-13428967267FAX: + 86-4008892163-239121
+ 86-2028819702-239121
Email: [email protected]
Contact Now
- Certifications
- Subscribe
-
Get email updates on new products
- New Products
- Electronic album
Base Material M7NE, used for 25Gbps Backplane Project, high frequency PCB, Immersion Gold, blind/buried via holes, press fit holes, Impedance control
- Layer count: 48L
- materials: M7NE
- Board thickness: 8.0+/-0.8mm
- Finishing Size: 870x500mm
- Min Line w/s: 5/5mil
- Min drill size [FHS/DHS] : 0.34mm/0.45mm
- Plating AR DHS : 18:1
- Surface finish: ENIG
- Structure: 1+N+2+N+1
- Other : Press fit blind via hole
- Impedance Tol: +/-8%
- Press fit hole location Tol: +/- 1mil (At one connecter)
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
Special requirement:ENIG, Impedance: Tol: +/-7%, Press fit hole
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
Special requirement:ENIG, Impedance: Tol: +/-7%, Press fit hole
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
Tag: