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Base Material M7NE, used for 25Gbps Backplane Project, high frequency PCB, Immersion Gold, blind/buried via holes, press fit holes, Impedance controlBase Material M7NE, used for 25Gbps Backplane Project, high frequency PCB, Immersion Gold, blind/buried via holes, press fit holes, Impedance controlBase Material M7NE, used for 25Gbps Backplane Project, high frequency PCB, Immersion Gold, blind/buried via holes, press fit holes, Impedance control

Base Material M7NE, used for 25Gbps Backplane Project, high frequency PCB, Immersion Gold, blind/buried via holes, press fit holes, Impedance control

  • Layer count: 48L
  • materials:  M7NE
  • Board thickness:  8.0+/-0.8mm
  • Finishing Size: 870x500mm
  • Min Line w/s: 5/5mil
  • Min drill size [FHS/DHS] : 0.34mm/0.45mm
  • Plating  AR DHS : 18:1
  • Surface finish: ENIG
  • Structure: 1+N+2+N+1
  • Other :  Press fit blind via hole
  • Impedance Tol: +/-8%
  • Press fit hole location Tol: +/- 1mil (At one connecter)
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
Special requirement:ENIG, Impedance:  Tol: +/-7%, Press fit hole

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side

Layer structure



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