The basic process components of SMT
SMT stands for Surface Mount Technology (abbreviation of Surface Mount Technology) and is currently the most popular technology and process in the electronics assembly industry. It is a kind of leadless or short lead surface assembly components (SMC/SMD for short) mounted on the surface of the Printed Circuit Board (PCB) or other substrates through reflow soldering or dip soldering, etc. Method to weld and assemble the circuit assembly technology.
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The basic process components of SMT include: screen printing (or dispensing), placement (curing), reflow soldering, cleaning, testing, and repair.
1. Silk screen: Its function is to print solder paste or patch glue onto the PCB pads to prepare for the soldering of components. The equipment used is a screen printing machine (screen printing machine), located at the forefront of the SMT production line.
2. Dispensing: It is to drop the glue onto the fixed position of the PCB, and its main function is to fix the components on the PCB. The equipment used is a glue dispenser, located at the forefront of the SMT production line or behind the testing equipment.
3. Mounting: Its function is to accurately mount the surface mount components to the fixed position of the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.
4. Curing: Its function is to melt the patch glue, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a curing oven, located behind the placement machine in the SMT production line.
5. Reflow soldering: Its function is to melt the solder paste, so that the surface assembly components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the SMT production line.
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6. Cleaning: Its function is to remove the solder residues such as flux that are harmful to the human body on the assembled PCB board. The equipment used is a washing machine, the location can be not fixed, it can be online or offline.
7. Inspection: Its function is to inspect the welding quality and assembly quality of the assembled PCB board. The equipment used includes magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. The location can be configured in a suitable place on the production line according to the needs of inspection.
8. Rework: Its function is to rework the PCB boards that have failed to detect faults. The tools used are soldering iron, rework station, etc. Configured at any position in the production line.