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Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):18.6; Dim Y (mm):92.2
Panelisation:Dim X (mm):115;Dim Y (mm):106.2;No Of UPS:5
Special:peelable mask:N
Routing/Punching:CNC More

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Solder Mask Silkscreen: Matte Green/ N/A
Single board size:Dim X (mm):21.5; Dim Y (mm):60.3
Panelisation:Dim X (mm):108;Dim Y (mm):138.1;No Of UPS:8
Special:peelable mask:N
Routing/Punching:CNC More

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Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):21;Dim Y (mm):12
Panelisation:Dim X (mm):90;Dim Y (mm):68;No Of UPS:16
Special:peelable mask:N More

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Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):21;Dim Y (mm):12
Panelisation:Dim X (mm):90;Dim Y (mm):68;No Of UPS:16
Special:peelable mask:N More

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Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):21;Dim Y (mm):12
Panelisation:Dim X (mm):90;Dim Y (mm):68;No Of UPS:16
Special:peelable mask:N More

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Surface Finishing:ENIG Au:0.05-0.12UM
Solder Mask Silkscreen: Green / n/a
Single board size:Dim X (mm):29.8; Dim Y (mm):11.2
Panelisation:Dim X (mm):73.6;Dim Y (mm):74;No Of UPS:10
Special:peelable mask:N
Routing/Punching:CNC More

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Solder Mask Silkscreen: Green / White
Single board size:Dim X (mm):63.7; Dim Y (mm):47.1
Panelisation:Dim X (mm):143.4;Dim Y (mm):94.2;No Of UPS:4
Special:peelable mask:N
Routing/Punching:CNC More

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Solder Mask Silkscreen: Green / White
Single board size:Dim X (mm):63.7; Dim Y (mm):47.1
Panelisation:Dim X (mm):143.4;Dim Y (mm):94.2;No Of UPS:4
Special:peelable mask:N
Routing/Punching:CNC More

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Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):18.6; Dim Y (mm):92.2
Panelisation:Dim X (mm):115;Dim Y (mm):106.2;No Of UPS:5
Special:peelable mask:N
Routing/Punching:CNC More

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Solder Mask Silkscreen: Matte Green/ N/A
Single board size:Dim X (mm):21.5; Dim Y (mm):60.3
Panelisation:Dim X (mm):108;Dim Y (mm):138.1;No Of UPS:8
Special:peelable mask:N
Routing/Punching:CNC More

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Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):21;Dim Y (mm):12
Panelisation:Dim X (mm):90;Dim Y (mm):68;No Of UPS:16
Special:peelable mask:N More

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Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):21;Dim Y (mm):12
Panelisation:Dim X (mm):90;Dim Y (mm):68;No Of UPS:16
Special:peelable mask:N More

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Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
Solder Mask Silkscreen: Black / White
Single board size:Dim X (mm):21;Dim Y (mm):12
Panelisation:Dim X (mm):90;Dim Y (mm):68;No Of UPS:16
Special:peelable mask:N More

: 6L rigid-flexible PCB with no x-out

Surface Finishing:ENIG Au:0.05-0.12UM
Solder Mask Silkscreen: Green / n/a
Single board size:Dim X (mm):29.8; Dim Y (mm):11.2
Panelisation:Dim X (mm):73.6;Dim Y (mm):74;No Of UPS:10
Special:peelable mask:N
Routing/Punching:CNC More

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Solder Mask Silkscreen: Green / White
Single board size:Dim X (mm):63.7; Dim Y (mm):47.1
Panelisation:Dim X (mm):143.4;Dim Y (mm):94.2;No Of UPS:4
Special:peelable mask:N
Routing/Punching:CNC More

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Solder Mask Silkscreen:Green
Single board size:Dim X (mm):80;Dim Y (mm):116
Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
Special:peelable mask:N
Routing/Punching:CNC More

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PCB P/N:259278
Material: FR-4
Layer: 2L
Board thk:3.0mm
copper thk:35UM
Smallest hole size:0.3MM More

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Board thickness:1.27+/-0.1mm
Finishing Size:151.20x287.60mm(1*9)
Min Line w/s：inn 75/75um; out 75/100um
Min drill size [FHS/DHS] :0.25/0.50mm
Surface finish: Au Plating + OSP
Other : HF More

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PCB P/N:2597876
Material: FR-4
Layer: 18L
Board thk:2.4mm+10%
copper thk:35UM
Smallest hole size:0.2MM More

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PCB P/N:104_DCP_R2
Layer Count:4L
Material:FR-4 TG130
Board thk:1.6mm
copper thk:1/1/1/1oz
Smallest hole size:0.3MM More

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PCB P/N:869
Layer Count:6L
Material: Polyimide + FR-4
Board thk:1.6mm
copper thk:1/1/1/1/1/1oz
Smallest hole size:0.3MM More

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PCB P/N:223896
Layer:10L
Material: FR-4
Board thk:2.4mm
Copper thk:35UM
Smallest hole size:0.3MM More

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Layers: 2
Material: FR4
Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White More

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Layers: 2
Material: FR4
Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White More

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Layers: 2
Material: FR4
Finished Thickness: 1.8mm +/- 0.15mm
Outer Layer Copper Thickness: 1.5oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White More