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china pcb manufacture, led pcb board Printed circuit board, Printed circuit board in chinachina pcb manufacture, led pcb board Printed circuit board, Printed circuit board in china

china pcb manufacture, led pcb board Printed circuit board, Printed circuit board in china

  • PCB P/N:104_DCP_R2
  • Layer Count:4L
  • Material:FR-4 TG130
  • Board thk:1.6mm
  • copper thk:1/1/1/1oz
  • Smallest hole size:0.3MM
  • No. of holes (pcs):295
  • line w/s:12/8mil
  • Impedance control. Y / N (Tol %):N
  • Surface Finishing:ENIG    Au:0.05-0.10UM
  • Solder Mask Silkscreen:Green
  • Single board size:Dim X (mm):80;Dim Y (mm):116
  • Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
  • Special:peelable mask:N
  • Routing/Punching:CNC
Product Description:
Quick Details

Place of Origin:

Guang dong, China (Mainland)

Brand Name:

O-Leading

Model Number:

power bank pcb assembly pcba manufacturer

Base Material:

FR-4,,Aluminum

Copper Thickness:

0.5oz-5oz

Board Thickness:

0.1-5mm

Min. Hole Size:

0.2mm

Min. Line Width:

0.2mm

Min. Line Spacing:

0.2mm

Surface Finishing:

immersion gold ,OSP,lead free HASL

color:

blue ,red ,green,black.yellow

price:

$0.1-$10

applicable to:

led,mobile phone,air conditioners,washing machines

character:

 Industrial Control pcb

size:

0.01m3-10m3

certificates:

ISO9001,UL,RoHS,SGS

Q/CTN:

10PCS-100PCS

desigh type:

client requirement

weight:

0.01kg -5kg

MOQ:

10pcs

 

  


Packaging & Delivery

Packaging Details:

16 years professional OEM pcb board manufacturer

Delivery Detail:

7-12days

  

Product Description

16 years professional OEM pcb board manufacture

 

item

2014

2015~2016

2017~2018

Volume

Sample

Volume

Sample

Volume

Sample

Layer count

32

42

38

44

42

48

Min Line/space (μm)

50/50

40/45

40/45

40/40

35/40

35/35

Min drill hole
diameter (mm)

0.15

0.10

0.15

0.10

0.15

0.10

Aspect ratio 
of PTH

14:1

16:1

16:1

18:1

18:1

20:1

N+C+N

4+C+4

5+C+5

5+C+5

6+C+6

5+C+5

6+C+6

Any layer interconnection

5+2+5

6+2+6

5+2+5

6+2+6

5+2+5

6+2+6

Plate filling via

YES

--

YES

--

YES

--

Min. core thickness (exclude copper) (μm)

50

40

40

30

40

30

Min. Laser Drill diameter (μm)

75

65

65

50

50

40

Via on buried 
hole/stacked via

YES

--

YES

--

YES

--

Material

FR4, Megtron, Nelco, Rogers, Heavy Copper, etc.

Embedded capacitor PCB

 

YES

--

YES

--

YES

--

Surface Process

Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin,
 Flash gold, Gold finger plating,  Selective hard gold plating, 
Peelable solder mask, Carbon ink





























O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs. Venessa

Send your inquiry directly to us
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