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Black solder mask pcb with half plated hole
- PCB P/N:Black solder mask pcb with half plated hole
- Layer Count:4L
- Material:FR-4 TG170
- Board thk:1.6mm
- copper thk:1/1/1/1oz
- Smallest hole size:0.3MM
- No. of holes (pcs):98
- line w/s:5/5mil
Welcome to O-leading |
O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. (Multilayer pcb Printed company)
In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward.
Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.
We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time.
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Product Description |
PCB P/N | Black solder mask pcb with half plated hole |
Layer Count | 4L |
Material | FR-4 TG170 |
Board thk | 1.6mm |
copper thk | 1/1/1/1oz |
Smallest hole size | 0.3mm |
No. of holes (pcs) | 98 |
line w/s | 5/5mil |
Impedance control. Y / N (Tol %) | N |
Surface Finishing | ENIG Au:0.05-0.10UM |
Solder Mask Silkscreen | Black / White |
Single board size | Dim X (mm):21;Dim Y (mm):12 |
Panelisation | Dim X (mm):90;Dim Y (mm):68;No Of UPS:16 |
Special:peelable mask | N |
Routing/Punching | CNC |
Our Team |
Certifications |
Packaging & Delivery |
Process Capability |
PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink
SMT Production Capabilities
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm