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High Quality PCBs china, Printed circuit board supplier, Multilayer pcb Printed company

High Quality PCBs china, Printed circuit board supplier, Multilayer pcb Printed company

  • Layer count: 6L  MLB
  • Materials:Mid-Tg  EM-370(5)
  • Board thickness:1.27+/-0.1mm
  • Finishing Size:151.20x287.60mm(1*9)
  • Min Line w/s:inn 75/75um; out 75/100um
  • Min drill size [FHS/DHS] :0.25/0.50mm
  • Surface finish: Au Plating + OSP
  • Other : HF
Welcome to O-leading

O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. 

In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. 

Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.Engine Power Module manufacturer china

We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time. 

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED 

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity  indicator card on top side

 Product Description

Layer Count  6L  MLB
Material  Mid-Tg  EM-370(5)
Board thk  1.27+/-0.1mm
line w/s inn 75/75um; out 75/100um
Min drill size [FHS/DHS] 0.25/0.50mm
Surface finish  Au Plating + OSP
Other HF

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side

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 Process Capability

PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external:  4.0mil/4.0mil
Max Aspect Ratio:  10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches):  635*1500mm
Minimum Drilled Hole Size:  4mil
PIated Hole Tolerance:  +/-3mil
BIind/Buried Vias (AII Types):  YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
              Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

SMT Production Capabilities
PCB Material:  FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component:  0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision:  +/-0.03mm


O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs.Fancy

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