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6L High TG170 pcb with BGA 8mil6L High TG170 pcb with BGA 8mil6L High TG170 pcb with BGA 8mil

6L High TG170 pcb with BGA 8mil

  • PCB P/N:6L High TG170 pcb with BGA 8mil
  • Layer Count:6L
  • Material:FR-4 TG170
  • Board thk:1.60mm
  • copper thk:1/1/1/1/1/1oz
  • Smallest hole size:0.20mm
  • No. of holes (pcs):683
  • line w/s:4/4mil
  • Impedance control. Y / N (Tol %):Y
  • Surface Finishing:ENIG    Au:0.05-0.10UM
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O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. (led pcb board Printed circuit board

In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. 

Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.

We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time.

led pcb board Printed circuit board

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity  indicator card on top side

Product Description
PCB P/N  6L High TG170 pcb with BGA 8mil  
Layer Count  6L 
Material  FR-4 TG170  
Board thk  1.60mm 
copper thk  1/1/1/1/1/1oz  
Smallest hole size  0.20mm 
No. of holes (pcs)  683 
line w/s  4/4mil  
Impedance control. Y / N (Tol %)  Y 
Surface Finishing  ENIG    Au:0.05-0.10UM  
Solder Mask Silkscreen  Green / White  
Single board size  Dim X (mm):63.7; Dim Y (mm):47.1  
Panelisation  Dim X (mm):143.4;Dim Y (mm):94.2;No Of UPS:4  
Special:peelable mask 
Routing/Punching  CNC 

Our Team


Packaging & Delivery

 Process Capability

PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external:  4.0mil/4.0mil
Max Aspect Ratio:  10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches):  635*1500mm
Minimum Drilled Hole Size:  4mil
PIated Hole Tolerance:  +/-3mil
BIind/Buried Vias (AII Types):  YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
              Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

SMT Production Capabilities
PCB Material:  FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component:  0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision:  +/-0.03mm



Contact Person:Mrs.Fancy


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