5G key material PCB high frequency substrate
In RF devices, many different types of high-frequency circuits are required, including power amplifiers, and appropriate circuit materials are required.
Filled resin material is one of the key materials that affect the performance of high frequency PCB boards. As one of the PCB's upstream raw materials, special resin as a filler material plays a role in adhering and improving the performance of the board. In the 5G era, the PCB for base stations will tend to have more layers of highly integrated designs, which puts new requirements on the PCB and the copper-clad substrate itself.
Compared with 4G, 5G has a larger amount of data, a larger transmission frequency, and a higher frequency band. This requires the base station PCB board to have better transmission performance and heat dissipation performance, which means that 5G base station PCB board must use more High frequency, higher transmission speed, and better heat resistance.
At present, PCBs preferably use polytetrafluoroethylene (PTFE) as the filling resin material. Filling polytetrafluoroethylene and polytetrafluoroethylene reinforced with glass fabric or cermet can reduce the cold flow and linear expansion coefficient of the composite material, and improve wear resistance And thermal conductivity, but also reduces the cost of the product.