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PCBA,2Layer,Black soldermask,used for communication equipment
- Layers: 2
- Material: FR4
- Finished Thickness: 1.57mm +/- 10%
- Outer Layer Copper Thickness: 1oz
- Finish: ENIG (Au:2-5u")
- Soldermask (Color): Both Sides, LPI (Black)
- Silkscreen (Color): Both Sides, White
Product Description
Quick Details
| Place of Origin | Guang dong, China (Mainland) | Brand Name | O-Leading |
| Base Material | FR-4,,Aluminum | Copper Thickness | 0.5oz-5oz |
| Min. Hole Size | 0.2mm | Min. Line Width | 0.2mm |
| Surface Finishing | immersion gold ,OSP,lead free HASL | Board Thickness | 0.1-5mm |
| applicable to | led,mobile phone,air conditioners,washing machines | character | Industrial Control pcb |
| certificates | ISO9001,UL,RoHS,SGS | Q/CTN | 10PCS-100PCS |
| weight | 0.01kg -5kg | MOQ | 10pcs |
| Model Number | power bank pcb assembly pcba manufacturer | Min. Line Spacing | 0.2mm |
| color | blue ,red ,green,black.yellow | price | $0.1-$10 |
| desigh type | client requirement | desigh type | client requirement |
Packaging & Delivery
| Packaging Details | Vacuum packaged |
| Delivery Detail | 7-9days |
Product Description
16 years professional OEM pcb board manufacture
| item | 2014 | 2015~2016 | 2017~2018 | |||
| Volume | Sample | Volume | Sample | Volume | Sample | |
| Layer count | 32 | 42 | 38 | 44 | 42 | 48 |
| Min Line/space (μm) | 50/50 | 40/45 | 40/45 | 40/40 | 35/40 | 35/35 |
| Min drill hole diameter (mm) |
0.15 | 0.10 | 0.15 | 0.10 | 0.15 | 0.10 |
| Aspect ratio of PTH |
14:1 | 16:1 | 16:1 | 18:1 | 18:1 | 20:1 |
| N+C+N | 4+C+4 | 5+C+5 | 5+C+5 | 6+C+6 | 5+C+5 | 6+C+6 |
| Any layer interconnection | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 | 5+2+5 | 6+2+6 |
| Plate filling via | YES | -- | YES | -- | YES | -- |
| Min. core thickness (exclude copper) (μm) | 50 | 40 | 40 | 30 | 40 | 30 |
| Min. Laser Drill diameter (μm) | 75 | 65 | 65 | 50 | 50 | 40 |
| Via on buried hole/stacked via |
YES | -- | YES | -- | YES | -- |
| Material | FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. | |||||
| Embedded capacitor PCB | YES | -- | YES | -- | YES | -- |
| Surface Process | Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, Flash gold, Gold finger plating, Selective hard gold plating, Peelable solder mask, Carbon ink |
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