Home > Category > PCB Application Fields > Controller PCB > PCB with imedance control, china Mobile phone pcb board manufacture
Contact Us
TEL: + 86-13428967267

FAX: + 86-4008892163-239121  

          + 86-2028819702-239121

Email: sales@o-leading.com Contact Now
Certifications
New Products
Electronic album

PCB with imedance control, china Mobile phone pcb board manufacturePCB with imedance control, china Mobile phone pcb board manufacture

PCB with imedance control, china Mobile phone pcb board manufacture

  • Layers: 2
  • Material: FR4
  • Finished Thickness: 1.57mm +/- 10%
  • Outer Layer Copper Thickness: 1oz
  • Finish: ENIG (Au:2-5u")
  • Soldermask (Color): Both Sides, LPI (Black)
  • Silkscreen (Color): Both Sides, White
 Welcome to O-leading

O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. 

In general, our global customers are very impressed with our services:Rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. 

Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.

PLEASE CLICK THESE FOR MORE INFORMATION:PCB with imedance control

 Product Description

Layers: 2
Material: FR4
Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White 

Electrical test

FINISH: THIS BOARD SHALL BE IMMERSION GOLD PLATED ACCORDING TO IPC-6012.
THICKNESS SHALL BE .050uM OVER 3-6uM NICKEL.

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED, EXCEPT VIAS .500 FINISH OR SMALLER.

Layer Key:
==========
*.GM4: Board Outline
*.TXT: NC Drill File
*.GTP: Top Paste
*.GTO: Top Silkscreen
*.GTS: Top Soldermask
*.GTL: Top Copper Layer
*.GBL: Bottom Copper Layer
*.GBS: Bottom Soldermask
*.GBO: Bottom Silkscreen
*.GBP: Bottom Paste





Our Team




Certifications







Packaging & Delivery






 Process Capability

PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external:  4.0mil/4.0mil
Max Aspect Ratio:  10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches):  635*1500mm
Minimum Drilled Hole Size:  4mil
PIated Hole Tolerance:  +/-3mil
BIind/Buried Vias (AII Types):  YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
              Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

SMT Production Capabilities
PCB Material:  FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component:  0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision:  +/-0.03mm


Tag:
O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs.Fancy

PDF Show:PDF

Send Inquiry
captcha