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Faster Networking Multi-Media Capability Powerful Processor Completely Upgraded Raspberry Pi 4 Model B 4GB RAM
AC DC Power Supply 110V 220V to 5V 700mA 3.5W Switching Switch Buck Converter, Regulated Step Down Voltage Regulator Module
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Impedance control. Y / N (Tol %):N
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Impedance control. Y / N (Tol %):N
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Single board size:Dim X (mm):21;Dim Y (mm):12
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Impedance control. Y / N (Tol %):N
Surface Finishing:ENIG Au:0.05-0.10UM
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Single board size:Dim X (mm):21;Dim Y (mm):12
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Single board size:Dim X (mm):63.7; Dim Y (mm):47.1
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Power Supply main PCB with blue solder mask
Impedance control. Y / N (Tol %):N
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Single board size:Dim X (mm):21;Dim Y (mm):12
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HDI 6L PCB with laser drill
Impedance control. Y / N (Tol %):N
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Black solder mask pcb with half plated hole
Impedance control. Y / N (Tol %):N
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6L High TG170 pcb with BGA 8mil
Solder Mask Silkscreen: Green / White
Single board size:Dim X (mm):63.7; Dim Y (mm):47.1
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Board thickness:1.27+/-0.1mm
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Min Line w/s:inn 75/75um; out 75/100um
Min drill size [FHS/DHS] :0.25/0.50mm
Surface finish: Au Plating + OSP
Other : HF More
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PCB P/N:2597876
Material: FR-4
Layer: 18L
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copper thk:35UM
Smallest hole size:0.2MM More
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PCB P/N:104_DCP_R2
Layer Count:4L
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copper thk:1/1/1/1oz
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Layers: 2
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Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White More
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Layers: 2
Material: FR4
Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White More
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Printed circuit board company, china Mobile phone pcb board manufacture, Holgen free pcb manufacturer china
Layers: 2
Material: FR4
Finished Thickness: 1.8mm +/- 0.15mm
Outer Layer Copper Thickness: 1.5oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White More
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china Mobile phone pcb board manufacture, HDI pcb Printed circuit board, Cheapest PCB makers china
PCB P/N:104_DCP_R2
Layer Count:4L
Material:FR-4 TG130
Board thk:1.6mm
copper thk:1/1/1/1oz
Smallest hole size:0.3MM More
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PCB P/N:104_DCP_R2
Layer Count:4L
Material:FR-4 TG130
Board thk:1.6mm
copper thk:1/1/1/1oz
Smallest hole size:0.3MM More
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Product DescriptionFINISH: THIS BOARD SHALL BE IMMERSION GOLD PLATED ACCORDING TO IPC-6012. THICKNESS SHALL BE .050uM OVER 3-6uM NICKEL. COPPER PLA... More
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Product DescriptionQuick Details Place of Origin: Guang dong, China (Mainland) Brand Name: O-Lea... More
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Product description: Quick details Place of origin: Guang dong, China (mainland) Brand: O-Le ... More
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COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in fl... More
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Product DescriptionQuick Details Place of Origin: Guang dong, China (Mainland) Brand Name: O-Lea... More
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COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED This PN required 2/2mil fine line ; fine thin,Low Dk Pack with colorless tra... More
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COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED This PN required 2/2mil fine line ; fine thin,Low Dk Pack with colorless tra... More
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