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Base Material Mid–Tg EM-355(D), used for 10L ELIC Smart phone, high frequency PCB, Immersion Gold+OSP, 2/2mil fine line. HDI PCBSBase Material Mid–Tg EM-355(D), used for 10L ELIC Smart phone, high frequency PCB, Immersion Gold+OSP, 2/2mil fine line. HDI PCBSBase Material Mid–Tg EM-355(D), used for 10L ELIC Smart phone, high frequency PCB, Immersion Gold+OSP, 2/2mil fine line. HDI PCBS

Base Material Mid–Tg EM-355(D), used for 10L ELIC Smart phone, high frequency PCB, Immersion Gold+OSP, 2/2mil fine line. HDI PCBS

  • Layer count: 10L ELIC
  • Materials:Mid – Tg   EM-355(D)
  • Board thickness:0.55+/-10%mm
  • Finishing Size: 93.54x93.96mm(1*2)
  • Min Line w/s:inn 50/50um; out 75/75um
  • Min drill size [FHS/DHS] :none
  • Micro via size/land: 100/225um
  • Surface finish: ENIG + OSP
  • Other : 2/2mil fine line ; fine thin,Low Dk 
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
This PN required 2/2mil fine line ; fine thin,Low Dk
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity  indicator card on top side

Layer structure




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