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Base Material Mid–Tg EM-355(D), used for 10L ELIC Smart phone, high frequency PCB, Immersion Gold+OSP, 2/2mil fine line. HDI PCBS
- Layer count: 10L ELIC
- Materials：Mid – Tg EM-355(D)
- Board thickness:0.55+/-10%mm
- Finishing Size: 93.54x93.96mm(1*2)
- Min Line w/s：inn 50/50um; out 75/75um
- Min drill size [FHS/DHS] :none
- Micro via size/land: 100/225um
- Surface finish: ENIG + OSP
- Other : 2/2mil fine line ; fine thin，Low Dk
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED
This PN required 2/2mil fine line ; fine thin，Low Dk
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
This PN required 2/2mil fine line ; fine thin，Low Dk
Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Layer structure
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