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4L yellow coil board with FR-4 core material, ENIG surface finish, PCB assembly in China, 1.8mm final board thickness, consumer consumer electronics application
- 1. PCB P / N: 223896
- 2. Layer: 10L
- 3. Material: FR-4
- 4. Board board: 2.4mm
- 5.Thk Copper: 35um
- 6. Smallest hole size: 0.3MM
- 7. Number of holes (pcs): 938
- 8. Line w / s: 4.5 / 2.5mil
- 9. Impedance control. Y / N (Tol%): Y
- 10. Surface immersion gold
- 11. Silk screen welding mask: Green
- 12. One panel Size: Dim Dim (mm): 195; Dim Y (mm): 345
- 13. Special: Applicable 10L PCB for industry control
- Direction / multiplication: CN
| Welcome to O-leading |
O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production.
In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. Printed circuit board manufacturer
Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.
COPPER PLATE HOLES MINIMUM .025 AVG, .020MIN .. HOLES MAY NOT NOT PLUGGED
Pack with transparent colorless bubble film, 25 pieces / pouch, put dehydrated into wing, put moisture indicator card on top side
|
Place of origin |
Guang Dong, China (Mainland) |
Brand Name |
O-Leading |
|
Basic article |
FR-4, and aluminum |
Thickness of copper |
0.5OZ-5OZ |
|
Accurate. The size of the hole |
0.2mm and |
Accurate. Display line |
0.2mm and |
|
Surface finishes |
Gold Immersion, OSP, HASL Lead free |
Thickness of the board |
0.1-5mm |
|
Apply to |
Mobile phones, Air conditioners, domestic, Washing machines |
Letter |
Industrial control pcb |
|
Certificates |
ISO9001, UL, ROHS, SGS |
Q / CTN |
10pcs-100PCS |
|
Weight |
0.01kg -5kg |
MOQ |
10 pieces |
| Model number | Power Bank PCB Assembly Manufacturer PCBA | Accurate. Line spacing | 0.2mm and |
| the color | Blue, Red, Green, Black | price | $ 0.1- $ 10 |
| Type desigh | Client requirements | Size | 0.01m3-10m3 |
| Our Team |
| Certifications |
| Packaging & Delivery |
| Process Capability |
PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Layer Count: 1Layer-32Layer
Finished copper thickness： 1/3oz-12oz
Min Line width/spacing internal： 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness： 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink
SMT Production Capabilities
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size：50x50mm
PCB Thickness：0.5mm-4.5mm
Board thickness：0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height：15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm