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led pcb board manufacturer, High quality pcb manufacturerled pcb board manufacturer, High quality pcb manufacturer

led pcb board manufacturer, High quality pcb manufacturer

  • Layers: 2
  • Material: FR4
  • Finished Thickness: 1.57mm +/- 10%
  • Outer Layer Copper Thickness: 1oz
  • Finish: ENIG (Au:2-5u")
  • Soldermask (Color): Both Sides, LPI (Black)
  • Silkscreen (Color): Both Sides, White
Welcome to O-leading

O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. 

In general, our global customers are very impressed with our services:rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. 

Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.



Layers: 2
Material: FR4
Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White 

Electrical test

FINISH: THIS BOARD SHALL BE IMMERSION GOLD PLATED ACCORDING TO IPC-6012.
THICKNESS SHALL BE .050uM OVER 3-6uM NICKEL.

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED, EXCEPT VIAS .500 FINISH OR SMALLER.

Layer Key:
==========
*.GM4: Board Outline
*.TXT: NC Drill File

*.GTP: Top Paste
*.GTO: Top Silkscreen
*.GTS: Top Soldermask
*.GTL: Top Copper Layer
*.GBL: Bottom Copper Layer
*.GBS: Bottom Soldermask
*.GBO: Bottom Silkscreen
*.GBP: Bottom Paste



led pcb board manufacturer

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 Process Capability

PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external:  4.0mil/4.0mil
Max Aspect Ratio:  10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches):  635*1500mm
Minimum Drilled Hole Size:  4mil
PIated Hole Tolerance:  +/-3mil
BIind/Buried Vias (AII Types):  YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
              Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

SMT Production Capabilities
PCB Material:  FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component:  0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision:  +/-0.03mm


O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs.Fancy

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