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Prototype PCB Assembly company china, Flash Gold manufacturer china, CERAMIC WAFER manufacturer china

Prototype PCB Assembly company china, Flash Gold manufacturer china, CERAMIC WAFER manufacturer china

  • PCB P/N: Q508756-C
  • Layer Count: 2L
  • Material: Base Ceramics
  • Board thk:0.50mm
  • copper thk:1/1oz
  • Smallest hole size: /
  • No. of holes (pcs): /
  • line w/s: 1.27mm
  • Impedance control. Y / N (Tol %):N
Welcome to O-leading

We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time.


Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity  indicator card on top side


Product Description
PCB P/N  Q508756-C 
Layer Count  2L 
Material  Base Ceramics 
Board thk  0.55mm 
copper thk  1/1oz 
Smalleat hole size   1.6mm 
No. of holes (pcs)  4 
line w/s  1.27mm 
Impedance control. Y / N (Tol %)  N 
Surface Finishing  ENIG 
Solder Mask Silkscreen  N/A 
Single board size  Dim X (mm):50;Dim Y (mm):55 
Panelisation  Dim X (mm):50;Dim Y (mm):55;No Of UPS:1 
Special:peelable mask  N 
Routing/Punching  CNC 


    1. How do O-Leading ensure quality? Flash Gold manufacturer china
    Our high quality standard is achieved with the following. 
    1.The process is strictly controlled under  ISO 9001:2008 standards. 
    2.Extensive use of software in managing the production process 
    3.State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing). 
    4.Dedicated quality assurance team with failure case analysis process 
    5.Continuous staff training and education 

    2. How do O-Leading keep your price competitive? 
    Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled or quadrupled; Chinese currency RMB had appreciated 31% over US dollar; And our labor cost also increased significantly.  However, O-Leading have kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes and improving efficiency. Our prices are very competitive in the industry at the same quality level. 
    We believe in a win-win partnership with our customers.  Our partnership will be mutually beneficial if we can provide you an edge on cost and quality. 

    3. What kinds of boards can O-Leading process? 
    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc. 

    4. What data are needed for PCB production? 
    It is best to provide data in Gerber 274-X format. In addition, Cam350, CAD, Protel 99se, PADS, DXP and Eagle can also be processed. 

    5. What’s the typical process flow for multi-layer PCB? 
    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond → Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
    Our Team


    Packaging & Delivery

     Process Capability

    PCB Production Capabilities
    Layer Count: 1Layer-32Layer
    Finished copper thickness: 1/3oz-12oz
    Min Line width/spacing internal: 3.0mil/3.0mil
    Min Line width/spacing external:  4.0mil/4.0mil
    Max Aspect Ratio:  10:1
    Board thickness: 0.2mm-5.0mm
    Max Panel size(inches):  635*1500mm
    Minimum Drilled Hole Size:  4mil
    PIated Hole Tolerance:  +/-3mil
    BIind/Buried Vias (AII Types):  YES
    Via Fill(Conductive,Non-Conductive): YES
    Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
                  Heavy Copper
    Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

    SMT Production Capabilities
    PCB Material:  FR-4,CEM-1,CEM-3,Aluminum-based board
    Max PCB size: 510x460mm
    Min PCB size:50x50mm
    PCB Thickness:0.5mm-4.5mm
    Board thickness:0.5-4mm
    Min Components size: 0201
    Standard chip size component:  0603 and larger
    Component max height:15mm
    Min lead pitch: 0.3mm
    Min BGA ball pitch:0.4mm
    Placement precision:  +/-0.03mm



    Contact Person:Mrs.Fancy

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