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HDI pcb Printed circuit board, Apply for Industry control project, high density Integrated,8L Printed circuit board from China
- PCB P / N: 109345
- Number of layers: 8L
- Material: NPG-150N
- Board THK: 0.57+/-10% mm
- Copper thk: 1 oz
- The smallest hole size: 0.12mm
- Number of holes (pcs.): 1020
- Line w / s: 2.4/3mil
- Impedance control. Y / N (Tol%): N
- Surface treatment: ENIG
- Mask for solder Silkscreen: Green
- The size of one board: Dim X (mm): 238; Dim Y (mm): 201.6
- Panelisation: Dim X (mm): ; Dim Y (mm):
- Specially: 8L HDI with board thickness 0.57mm,
- Routing / Perforation: CNC
|
Place of Origin |
Guang dong, China (Mainland) |
Brand Name |
O-Leading |
|
Base Material |
NPG-150N |
Copper Thickness |
1oz |
|
Min. Hole Size |
0.2mm |
Min. Line Width |
2.35mil |
|
Surface Finishing |
immersion gold |
color |
green |
|
applicable to |
Industry control |
character |
Industrial Control |
|
certificates |
ISO9001,UL,RoHS,SGS |
Q/CTN |
10PCS-100PCS |
|
weight |
0.01kg -5kg |
MOQ |
10pcs |
| Model Number | power bank pcb assembly pcba manufacturer | Board Thickness | 0.1-5mm |
| size | 0.01m3-10m3 | Min. Line Spacing | 3mil |
| desigh type | customer requirement | price | $0.1-$10 |
Packaging & Delivery
|
Packaging Details |
16 years professional OEM client board manufacturer |
|
Delivery Detail |
7-12days |
Product Description
16 years professional oem pcb board manufacturer china
|
item |
2017 |
2018~2020 |
2021~2023 |
|||
|
Volume |
Sample |
Volume |
Sample |
Volume |
Sample |
|
|
Layer count |
32 |
42 |
38 |
44 |
42 |
48 |
|
Min Line/space (μm) |
50/50 |
40/45 |
40/45 |
40/40 |
35/40 |
35/35 |
|
Min drill hole |
0.15 |
0.10 |
0.15 |
0.10 |
0.15 |
0.10 |
|
Aspect ratio |
14:1 |
16:1 |
16:1 |
18:1 |
18:1 |
20:1 |
|
N+C+N |
4+C+4 |
5+C+5 |
5+C+5 |
6+C+6 |
5+C+5 |
6+C+6 |
|
Any layer interconnection |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
|
Plate filling via |
YES |
-- |
YES |
-- |
YES |
-- |
|
Min. core thickness (exclude copper) (μm) |
50 |
40 |
40 |
thirty |
40 |
thirty |
|
Min. Laser Drill diameter (μm) |
75 |
65 |
65 |
50 |
50 |
40 |
|
Via on buried |
YES |
-- |
YES |
-- |
YES |
-- |
|
Material |
FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. |
|||||
|
Embedded capacitor PCB
|
YES |
-- |
YES |
-- |
YES |
-- |
|
Surface Process |
Lead-free HASL, ENIG, OSP, silver with immersion, tin of immersion, |
|||||
