Global PCB manufacturers in China
- Release on:2017-05-02
At this point in the manufacturing process of the printed circuit board, the PCB board contains traces of copper without the circuit components. To mount components, it is necessary to drill holes at the points where electrical and electronic components are placed. The holes are drilled either by means of lasers or by means of a special drill made of tungsten carbide.
When holes are drilled, hollow rivets are inserted in them or they are galvanized, which creates an electrical connection between the layers on the board. The masking material is then applied to the entire printed circuit board separately from the gaskets together with the holes. There are many types of masking materials, such as lead solder, lead-free solder, OSP (Entek), deep / solid gold (electrolytic nickel gold), immersion gold (nickel-electrolysis oil - ENIG), wire binder gold (pure gold 99.99% ), Immersion silver, instant gold, tin-tin (white tin), carbon ink and SN 100CL, alloy of tin, copper and nickel. The last step in the process of manufacturing printed circuit boards will be the screen printing of the board, so that the labels, as well as the inscriptions appear in the proper place.