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Material introduction of PCB board

2019-12-21 12:03:30

Organic material

Phenolic resin: Phenolic resin is also called bakelite, also known as bakelite powder. Originally colorless or yellow-brown transparent material, the market sales often add colorants and are red, yellow, black, green, brown, blue and other colors, there are particles, powder. Resistant to weak acids and bases, decomposes in case of strong acids, and corrosion in case of strong bases. Insoluble in water, soluble in organic solvents such as acetone and alcohol. It is obtained by polycondensation of phenol aldehyde or its derivative.

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Glass fiber: Glass fiber (original name: glass fiber) is an inorganic non-metallic material with excellent performance. There are many kinds of materials, which have the advantages of good insulation, strong heat resistance, good corrosion resistance, high mechanical strength, but disadvantages. It is brittle and has poor abrasion resistance. It is made of seven kinds of ores including pyrophyllite, quartz sand, limestone, dolomite, boronite, and boronite through high temperature melting, drawing, winding, weaving, etc. The diameter of the monofilament is several Micrometer to twenty micrometers, equivalent to 1 / 20-1 / 5 of a hair filament, each bundle of fiber filaments is composed of hundreds or even thousands of monofilaments. Glass fiber is generally used as a reinforcing material in composite materials, electrical insulation materials, thermal insulation materials, circuit substrates and other fields.

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Polyimide: PI for short, polyimide resin, appearance: transparent liquid, yellow powder, brown particles, amber particles, polyimide resin liquid, polyimide resin solution, polyimide resin powder, polyimide Resin particles, polyimide resin pellets, polyimide resin pellets, thermoplastic polyimide resin solution, thermoplastic polyimide resin powder, thermosetting polyimide resin solution, thermosetting polyimide resin powder , Thermoplastic polyimide pure resin, thermosetting polyimide pure resin 2. Polyimide PI molding methods include: high temperature curing, compression molding, dipping, spraying, calendering, injection molding, extrusion, die casting, coating Coating, casting, laminating, foaming, transfer molding, compression molding. And our epoxy resin and BT are all organic materials.

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Inorganic material

Aluminum substrate: The aluminum substrate is a metal-based copper-clad board with good heat dissipation function. Generally, a single panel is composed of a three-layer structure. They are circuit layer (copper foil), insulation layer and metal base layer. Common in LED lighting products. There are two sides, the white side is soldered to the LED pins, and the other side shows the aluminum color. Generally, it will be in contact with the heat-conducting part after applying the heat-condensing paste. There are also ceramic substrates and so on.

Copper substrate: Copper substrate is one of the more expensive metal substrates. Its thermal conductivity is much better than aluminum and iron substrates. It is suitable for high-frequency circuits and areas with high and low temperature changes, as well as heat dissipation and building decoration industries for precision communication equipment. Also ceramic substrates are inorganic materials, which are mainly used for heat dissipation.