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control board design and manufacturing pcb and PCBA assemblingcontrol board design and manufacturing pcb and PCBA assemblingcontrol board design and manufacturing pcb and PCBA assembling

control board design and manufacturing pcb and PCBA assembling

  • Place of Origin:Guangdong, China
  • Model Number:MT_T2_board
  • Supplier Type:OEM
  • Sample:Avaliable
  • Application:Electronics Device
  • Function:control board
  • Certificate:ROSH. ISO9001. UL
  • PCB Assembly Method:Wave Solder Assembly
  • Number of Layers:2L
  • Material:FR4
  • Solder mask:Green
  • Surface treatment:LF-HASL
  • Warranty:1 Year
 Welcome to O-leading

O-Leading strives to be your one stop solution partner in EMS supply chain, including PCB design , PCB fabrication and PCB assembly (PCBA).We provide some of the most advanced PCB technology, including HDI PCBs,multilayer PCBs, Rigid-Flexible PCBs.We can support from quick turn prototype to medium & mass Production. 

In general, our global customers are very impressed with our services:Rapid response, competitive price and quality commitment.Providing more valuable technical service and overall solution is the way O-leading forward. 

Looking to the future, O-leading will concentrate on the innovation and development of electronics manufacturing technology as always, and make persistent efforts on PCB & PCBA one-stop service to provide first-class services and create more value for our customers.

PLEASE CLICK THESE FOR MORE INFORMATION:high-density PCB technology

 Product Description




Our Team




Certifications







 Process Capability

  PCB Production Capabilities
  SMT Production Capabilities

Layer Count

1Layer-32Layer PCB Material          FR-4,CEM-1,CEM-3,Aluminum-based board

Finished copper thickness

1/3oz-12oz

Min Line width/spacing internal

3.0mil/3.0mil Max PCB size  510x460mm                      

Min Line width/spacing external

4.0mil/4.0mil Min PCB size  50x50mm

Max Aspect Ratio
                      
10:1 PCB Thickness 
0.5mm-4.5mm
Board thickness  0.2mm-5.0mm Board thickness
0.5-4mm
Max Panel size(inches) 635*1500mm
Min Components size 

0201
Minimum Drilled Hole Size 4mil    
Standard chip size component    

0603 and larger
PIated Hole Tolerance    +/-3mil Component max height
15mm                                           

BIind/Buried Vias (AII Types)

 YES Min lead pitch
0.3mm

Via Fill(Conductive,Non-Conductive)

YES                                  Min BGA ball pitch
0.4mm
Base Material FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,Heavy Copper Placement precision +/-0.03mm
Surface finishes HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

Packaging & Delivery



 FAQ


1. How do O-Leading ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
1.4.Dedicated quality assurance team with failure case analysis process
1.5.Continuous staff training and education

2. How do O-Leading keep your price competitive?
Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled or quadrupled; Chinese currency RMB had appreciated 31% over US dollar; And our labor cost also increased significantly.
However, O-Leading have kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes and improving efficiency. Our prices are very competitive in the industry at the same quality level.
We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an edgeon cost and quality.

3. What kinds of boards can O-Leading process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

4. What data are needed for PCB & PCBA production?
4.1 BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
4.2 PCB Gerber files.
4.3 PCB fabrication drawing and PCBA assembly drawing.
4.4 Test procedures.
4.5 Any mechanical restrictions such as assembly height requirements.

5. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

6. What’s the key equipments for HDI manufacturing?
Key equipment list is as following: Laser drilling machine, Pressing machine, VCP line, Automatic Exposing machine, LDI and etc.
The equipments we have are the best in the industry, laser drilling machines are from Mitsubishi and Hitachi, LDI machines are from Screen(Japan), Automatic Exposing machines are also from Hitachi, all of them make we can meet customer’s technical requirements.

7. How many types of surface finish O-lead can do?
O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

8. What’s your capability for FPC? Can O-Leading provide SMT service also?
O-Leading can fabricate FPC from single layer to 8layer, the working panel size can be as large as 2000mm*240mm, please find the details in the page “Flex Capability”
We also provide SMT one stop service to customer.

9. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
Different manufacturing countries.

10. What’s the definition of PCB, PWB and FPC and what’s the difference?
PCB is short for Printed Circuit Board;
PWB is short for Printed Wire Board, same meaning as Printed Circuit Board;
FPC is short for Flexible Printed Board.

11. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.

12. What’s the merits of O-leading's rIgid-flex PCB?
O-leading’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.

13. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.


O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs.Fancy

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