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Pcb design in china, HDI pcb Printed circuit board
- PCB P/N:104_DCP_R2
- Layer Count:4L
- Material:FR-4 TG130
- Board thk:1.6mm
- copper thk:1/1/1/1oz
- Smallest hole size:0.3MM
- No. of holes (pcs):295
- line w/s:12/8mil
- Impedance control. Y / N (Tol %):N
- Surface Finishing:ENIG Au:0.05-0.10UM
- Solder Mask Silkscreen:Green
- Single board size:Dim X (mm):80;Dim Y (mm):116
- Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
- Special:peelable mask:N
- Routing/Punching:CNC
|
Place of Origin |
Guang dong, China (Mainland) |
Brand Name |
O-Leading |
|
Base Material |
FR-4,,Aluminum |
Copper Thickness |
0.5oz-5oz |
|
Min. Hole Size |
0.2mm |
Min. Line Width |
0.2mm |
|
Surface Finishing |
immersion gold ,OSP,lead free HASL |
Board Thickness |
0.1-5mm |
|
applicable to |
led,mobile phone,air conditioners,washing machines |
character |
Industrial Control pcb |
|
certificates |
ISO9001,UL,RoHS,SGS |
Q/CTN |
10PCS-100PCS |
|
weight |
0.01kg -5kg |
MOQ |
10pcs |
| Model Number | power bank pcb assembly pcba manufacturer | Min. Line Spacing | 0.2mm |
| color | blue ,red ,green,black.yellow | price | $0.1-$10 |
| desigh type | client requirement | size | 0.01m3-10m3 |
|
Packaging Details |
16 years professional OEM pcb board manufacturer |
|
Delivery Detail |
7-12days |
Product Description
16 years professional OEM pcb board manufacture
|
item |
2014 |
2015~2016 |
2017~2018 |
|||
|
Volume |
Sample |
Volume |
Sample |
Volume |
Sample |
|
|
Layer count |
32 |
42 |
38 |
44 |
42 |
48 |
|
Min Line/space (μm) |
50/50 |
40/45 |
40/45 |
40/40 |
35/40 |
35/35 |
|
Min drill hole |
0.15 |
0.10 |
0.15 |
0.10 |
0.15 |
0.10 |
|
Aspect ratio |
14:1 |
16:1 |
16:1 |
18:1 |
18:1 |
20:1 |
|
N+C+N |
4+C+4 |
5+C+5 |
5+C+5 |
6+C+6 |
5+C+5 |
6+C+6 |
|
Any layer interconnection |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
|
Plate filling via |
YES |
-- |
YES |
-- |
YES |
-- |
|
Min. core thickness (exclude copper) (μm) |
50 |
40 |
40 |
30 |
40 |
30 |
|
Min. Laser Drill diameter (μm) |
75 |
65 |
65 |
50 |
50 |
40 |
|
Via on buried |
YES |
-- |
YES |
-- |
YES |
-- |
|
Material |
FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. |
|||||
|
Embedded capacitor PCB
|
YES |
-- |
YES |
-- |
YES |
-- |
|
Surface Process |
Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin, |
|||||
