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Layers: 2
Material: FR4
Finished Thickness: 1.8mm +/- 0.15mm
Outer Layer Copper Thickness: 1.5oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White

Electrical test :100% passed

Final Board thickness:1.8+/-0.15mm

FINISH: THIS BOARD SHALL BE IMMERSION GOLD PLATED ACCORDING TO IPC-6012.
THICKNESS SHALL BE .050uM OVER 3-6uM NICKEL.

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED,

Packaging & Delivery

Packaging Details	Vacuum packaged
Delivery Detail	7-10days

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