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Gold finger multilayer PCBGold finger multilayer PCB

Gold finger multilayer PCB

  • PCB P/N:700200573-01A
  • Layer Count:4L
  • Material:FR-4 TG130
  • Board thk:1.6mm
  • copper thk:1/1/1/1oz
  • Smallest hole size:0.3MM
  • No. of holes (pcs):595
  • line w/s:8/8mil
  • Impedance control. Y / N (Tol %):N
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We are professional PCB manufacturer with more than ten years experiences . Products range-single, double side ,multi-layer PCB ,flexible PCB and MCPCB.We can provide fast prototype service – S/S in 24hrs , 4-8layers in 48-96 working hrs production time. (oem pcb board manufacturer china

COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side


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Product Description

  • PCB P/N 700200573-01A
    Layer Count 4L
    Material FR-4 TG130
    Board thk 1.6mm
    copper thk 1/1/1/1oz
    Smallest hole size 0.3MM
    No. of holes (pcs) 595
    line w/s 8/8mil
    Impedance control. Y / N (Tol %) N
    Surface Finishing LF HAL + Plated Gold finger( Au:1.27um)
    Solder Mask Silkscreen Green/ White
    Single board size Dim X (mm):181.6;Dim Y (mm):106.7
    Panelisation Dim X (mm):181.6;Dim Y (mm):111.7;No Of UPS:1
    Special N
    Routing/Punching CNC + Bevel

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Process Capability

PCB Production Capabilities
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
              Heavy Copper
Surface finishes: HASL,OSP,ENIG,HAL-LF,lmmersion silver,lmmersion Tin,Gold fingers,Carbon ink

SMT Production Capabilities
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm


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