The Challenges of Panelizing PCBs
Panelization presents a number of challenges in several areas:
1.Depanelization– disadvantages of some depanelization methods:
Using a router could require additional cleaning prior to shipment. This method produces a lot of dust which must be vacuumed out.
Saws can only cut in straight lines, so are appropriate only for certain arrays.
Lasers should be used only with an optimal board thickness of 1 mm or less.
2.Overhanging parts– require pre-routing to avoid interference with depanelization:
Components overhanging an edge can fall into adjacent parts.
Overhanging components can be damaged by a saw blade or router during depaneling.
3.Incomplete data files– sometimes incomplete files are provided to the Printed circuit board manufacturer, which can increase costs in several ways:
“Breakaway holes” or “mouse bites”– These tiny holes permit small PCBs to be used in an array. Drilling these holes leaves rough edges. If the mouse bites are not shown in the data file, the unexpected extra work to remove the edges increases labor costs.
Taking the above challenges into consideration, an experienced PCB manufacturer can avoid problems before they occur.Working with a preeminent printed circuit board supplier like O-Leading will ensure that your panelized PCB works as it should, is cost effective, and meets the highest industry standards.