Introduction of the types of final coating on PCB surface
o-leading.com
o-leading.com
2017-08-10 15:11:23
PCB's ultimate coating process has undergone significant changes in recent years. These changes are an increasing result of the constant demand for HASL (hot, air, solder, leveling) limitations and the HASL alternative approach.
PCB (Pcb prototype manufacturer china) requirements for non electrolytic nickel coatings
The surface of gold deposits
The ultimate goal of the circuit is to form a connection between the PCB (Small volume pcb manufacturer) and the component that has high physical strength and good electrical characteristics. If there is any oxide or contamination on the surface of the PCB, this welding connection will not happen with today's weak flux.
Gold deposits naturally on nickel and does not oxidize in long storage. However, gold does not precipitate on the oxidized nickel, so the nickel must be kept pure between the bath bath (nickel) and the gold dissolution.
hardness
Lead bonding requires a nickel hardness. If the lead causes the sediment to deform, the loss of friction may occur, and it helps the fuse to melt onto the substrate. SEM photographs showed no penetration to flat nickel / gold or nickel / palladium (Pd) / gold surfaces.
Lead bonding requires a nickel hardness. If the lead causes the sediment to deform, the loss of friction may occur, and it helps the fuse to melt onto the substrate. SEM photographs showed no penetration to flat nickel / gold or nickel / palladium (Pd) / gold surfaces.
PCB (Pcb prototype manufacturer china) requirements for non electrolytic nickel coatings
The surface of gold deposits
Gold deposits naturally on nickel and does not oxidize in long storage. However, gold does not precipitate on the oxidized nickel, so the nickel must be kept pure between the bath bath (nickel) and the gold dissolution.
Lead bonding requires a nickel hardness. If the lead causes the sediment to deform, the loss of friction may occur, and it helps the fuse to melt onto the substrate. SEM photographs showed no penetration to flat nickel / gold or nickel / palladium (Pd) / gold surfaces.
Lead bonding requires a nickel hardness. If the lead causes the sediment to deform, the loss of friction may occur, and it helps the fuse to melt onto the substrate. SEM photographs showed no penetration to flat nickel / gold or nickel / palladium (Pd) / gold surfaces.