The difference between PCB board and gilding board
Depositing gold is a layer of coating produced by chemical oxidation reduction reaction. The thickness is thicker. It is one of the chemical nickel, gold and gold layer deposition methods. It can reach the thicker gold layer. It is usually called gold deposit.
The gold and gold-plated formed by the crystal structure is not the same, Shen Jin for gold thickness is much thicker than gold-plated, gold deposit will be golden yellow, more yellow than gold-plated, more satisfied with the customer. The crystal structure of gold deposits is different from that of gold plating. Gold deposits are easier to weld than gold, and do not cause welding defects and cause customer complaints.
The stress of the gold plate is easier to control, and it is more conducive to the processing of the bonding products. At the same time, because the gold is more soft than the gold plating, the golden board is not wearable. As wiring becomes more and more dense, line width and spacing have reached 3-4MIL. Gold plating is easy to produce gold wire short circuit. The gold plate only has nickel gold on the pad, so it won't be short circuited.
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