How to layout to achieve heat it?
2, high fever devices plus radiator, thermal plate. When the PCB has a small number of devices when the heat is relatively large (less than 3), the heat sink can be added to the radiator or heat pipe, if the temperature can not come down, you can use a fan with a fan to enhance the heat effect. When the amount of heat generating device is more (more than 3), a large heat shield (plate) can be used. The whole heat sink on the element surface, with each component in contact with the heat. But because of the high and low consistency of components installed welding, cooling effect is not good. Usually in the component surface plus a soft thermal change thermal insulation pad to improve the cooling effect.
3, the use of reasonable alignment design to achieve heat, because the plate in the resin thermal conductivity is poor, and copper foil lines and holes are hot conductor, so to improve the copper foil residual rate and increase the thermal hole is the main means of heat.
4, high heat dissipation devices should be connected with the substrate should be able to reduce the thermal resistance between them. When the air flow on the circuit board always tends to flow in a small area of resistance, so in the printed circuit board configuration device, to avoid in a certain area to leave a larger airspace.
5, the temperature sensitive devices are best placed in the lowest temperature areas (such as the bottom of the device), do not put it directly on the heating device, multiple devices are best in the horizontal plane staggered layout.
6, to avoid the concentration of hot spots on the PCB, as far as possible evenly distributed in the power of the PCB board to maintain the PCB surface temperature performance uniformity and consistency. Often in the design process to achieve a strict uniform distribution is more difficult, but must avoid the power density is too high in the area, so as to avoid overheating the normal operation of the entire circuit.