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Small volume pcb manufacturer, Printed Circuit Board ManufacturerSmall volume pcb manufacturer, Printed Circuit Board Manufacturer

Small volume pcb manufacturer, Printed Circuit Board Manufacturer

  • PCB P/N:104_DCP_R2
  • Layer Count:4L
  • Material:FR-4 TG130
  • Board thk:1.6mm
  • copper thk:1/1/1/1oz
  • Smallest hole size:0.3MM
  • No. of holes (pcs):295
  • line w/s:12/8mil
  • Impedance control. Y / N (Tol %):N
  • Surface Finishing:ENIG    Au:0.05-0.10UM
  • Solder Mask Silkscreen:Green
  • Single board size:Dim X (mm):80;Dim Y (mm):116
  • Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
  • Special:peelable mask:N
  • Routing/Punching:CNC
Quick Details

Place of Origin

Guang dong, China (Mainland)

Brand Name

O-Leading

Base Material

FR-4,,Aluminum

Copper Thickness

0.5oz-5oz

Min. Hole Size

0.2mm

Min. Line Width

0.2mm

Surface Finishing

immersion gold ,OSP,lead free HASL

Board Thickness

0.1-5mm

applicable to

led,mobile phone,air conditioners,washing machines

character

 Industrial Control pcb

certificates

ISO9001,UL,RoHS,SGS

Q/CTN

10PCS-100PCS

weight

0.01kg -5kg

MOQ

10pcs

Model Number  power bank pcb assembly pcba manufacturer  Min. Line Spacing  0.2mm 
color  blue ,red ,green,black.yellow  price  $0.1-$10 
desigh type  client requirement  size  0.01m3-10m3 

Packaging & Delivery

Packaging Details

16 years professional OEM pcb board manufacturer

Delivery Detail

7-12days

Product Description

16 years professional OEM pcb board manufacture

item

2014

2015~2016

2017~2018

Volume

Sample

Volume

Sample

Volume

Sample

Layer count

32

42

38

44

42

48

Min Line/space (μm)

50/50

40/45

40/45

40/40

35/40

35/35

Min drill hole
diameter (mm)

0.15

0.10

0.15

0.10

0.15

0.10

Aspect ratio 
of PTH

14:1

16:1

16:1

18:1

18:1

20:1

N+C+N

4+C+4

5+C+5

5+C+5

6+C+6

5+C+5

6+C+6

Any layer interconnection

5+2+5

6+2+6

5+2+5

6+2+6

5+2+5

6+2+6

Plate filling via

YES

--

YES

--

YES

--

Min. core thickness (exclude copper) (μm)

50

40

40

30

40

30

Min. Laser Drill diameter (μm)

75

65

65

50

50

40

Via on buried 
hole/stacked via

YES

--

YES

--

YES

--

Material

FR4, Megtron, Nelco, Rogers, Heavy Copper, etc.

Embedded capacitor PCB

 

YES

--

YES

--

YES

--

Surface Process

Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin,
 Flash gold, Gold finger plating,  Selective hard gold plating, 
Peelable solder mask, Carbon ink




O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs.Fancy

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