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Printed Circuit Board Manufacturer, pcb board manufacturer china, Pcb prototype manufacturer china
- PCB p/N: 104_DCP_R2
- Number of layers: 4 L
- Material: Aluminum based
- THK panel: 1.6 mm
- Copper THK: 1/1/1/1
- Smallest hole size: 0.3 mm
- Not. of Holes (PCS): 295
- Line w/s: 12/8mil
- Impedance control. Y/N (tol%): n
- Surface Finishing:HASL-LF Au:0.05-0.10UM
- Screened Welding mask: Green
- Single board Size: Dim x (mm): 80; Dim y (mm): 116
- Paneling: Dim x (mm): 80; Dim y (mm): 116; Number of UPS: 1
- Special: Peelable Mask: N
- Routing/Punching: CNC
|
Place of Origin: |
Guang Dong, China (mainland) |
Brand Name: |
O-Leading |
Model number: |
Power Bank PCB Assembly PCBA Manufacturer |
|
Basic Material: |
En-4, aluminum |
Copper Thickness: |
0.5 oz-oz |
Thickness of Board: |
0.1 to 5 mm |
|
Min. Hole Size: |
0.2 mm |
Min. line width: |
0.2 mm |
Min. Spacing of lines: |
0.2 mm |
|
Surface Finishing: |
Gold immersion, OSP, lead free Hasl |
Color: |
Blue, red, green, black. Yellow |
Price: |
$0.1-$ 10 |
|
Applicable to: |
LED, cell phone, air Conditioners, Washing machines |
Character: |
Industrial Control PCB |
Size: |
0.01 M3-10 |
|
Certificates: |
ISO9001, UL, RoHS, SGS |
Q/CTN: |
10pcs-100pcs |
Type of Desigh: |
Customer's requirement |
|
Weight: |
0.01 kg-5 kg |
Moq: |
10pcs |
|
|
Packaging and Delivery
|
Packing Details: |
16 years professional PCB OEM Card manufacturer |
|
Delivery details |
7-12days |
Description of the Product
16 years professional OEM PCB board manufacture
|
Point |
2014 |
2015 ~ 2016 |
2017 ~ 2018 |
|||
|
Volume |
Sample |
Volume |
Sample |
Volume |
Sample |
|
|
Number of layers |
32 |
42 |
38 |
44 |
42 |
48 |
|
Min/Space line (μm) |
50/50 |
40/45 |
40/45 |
40/40 |
35/40 |
35/35 |
|
Min Drill Hole |
0.15 |
0.10 |
0.15 |
0.10 |
0.15 |
0.10 |
|
Aspect ratio |
14:1 |
16:1 |
16:1 |
18:1 |
18:1 |
20:1 |
|
n + C + N |
4 + C + 4 |
5 + C + 5 |
5 + C + 5 |
6 + C + 6 |
5 + C + 5 |
6 + C + 6 |
|
Any layer Interconnection |
5 + 2 + 5 |
6 + 2 + 6 |
5 + 2 + 5 |
6 + 2 + 6 |
5 + 2 + 5 |
6 + 2 + 6 |
|
Plate filling by |
Yes |
-- |
Yes |
-- |
Yes |
-- |
|
Min. Core thickness (Exclude copper) μm |
50 |
40 |
40 |
30 |
40 |
30 |
|
Min Laser drill. Diameter (μm) |
75 |
65 |
65 |
50 |
50 |
40 |
|
Via on buried |
Yes |
-- |
Yes |
-- |
Yes |
-- |
|
Material |
FR4, Megtron, Nelco, Rogers, heavy copper, etc. |
|||||
|
Integrated Capacitor PCB
|
Yes |
-- |
Yes |
-- |
Yes |
-- |
|
Surface process |
Lead-free HASL, Enig, OSP, immersion silver, immersion tin, |
|||||
