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Aluminum base pcb factory china, High power led aluminum pcb chinaAluminum base pcb factory china, High power led aluminum pcb chinaAluminum base pcb factory china, High power led aluminum pcb china

Aluminum base pcb factory china, High power led aluminum pcb china

  • PCB P/N:104_DCP_R2
  • Layer Count:4L
  • Material:Aluminum based
  • Board thk:1.6mm
  • copper thk:1/1/1/1oz
  • Smallest hole size:0.3MM
  • No. of holes (pcs):295
  • line w/s:12/8mil
  • Impedance control. Y / N (Tol %):N
  • Surface Finishing:HASL-LF    Au:0.05-0.10UM
  • Solder Mask Silkscreen:Green
  • Single board size:Dim X (mm):80;Dim Y (mm):116
  • Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
  • Special:peelable mask:N
  • Routing/Punching:CNC
Product Description:
Quick Details

Place of Origin

Guang dong, China (Mainland)

Brand Name

O-Leading

Base Material

FR-4,,Aluminum

Copper Thickness

0.5oz-5oz

Min. Hole Size

0.2mm

Min. Line Width

0.2mm

Surface Finishing

immersion gold ,OSP,lead free HASL

price

$0.1-$10

applicable to

led,mobile phone,air conditioners,washing machines

character

 Industrial Control pcb

certificates

ISO9001,UL,RoHS,SGS

Q/CTN

10PCS-100PCS

weight

0.01kg -5kg

MOQ

10pcs

Model Number  power bank pcb assembly pcba manufacturer  Board Thickness  0.1-5mm 
color  blue ,red ,green,black.yellow  size  0.01m3-10m3 
desigh type  client requirement  Min. Line Spacing 0.2mm

Packaging & Delivery

Packaging Details

16 years professional OEM pcb board manufacturer

Delivery Detail

7-12days

  

Product Description

16 years professional OEM pcb board manufacture

 

item

2014

2015~2016

2017~2018

Volume

Sample

Volume

Sample

Volume

Sample

Layer count

32

42

38

44

42

48

Min Line/space (μm)

50/50

40/45

40/45

40/40

35/40

35/35

Min drill hole
diameter (mm)

0.15

0.10

0.15

0.10

0.15

0.10

Aspect ratio 
of PTH

14:1

16:1

16:1

18:1

18:1

20:1

N+C+N

4+C+4

5+C+5

5+C+5

6+C+6

5+C+5

6+C+6

Any layer interconnection

5+2+5

6+2+6

5+2+5

6+2+6

5+2+5

6+2+6

Plate filling via

YES

--

YES

--

YES

--

Min. core thickness (exclude copper) (μm)

50

40

40

30

40

30

Min. Laser Drill diameter (μm)

75

65

65

50

50

40

Via on buried 
hole/stacked via

YES

--

YES

--

YES

--

Material

FR4, Megtron, Nelco, Rogers, Heavy Copper, etc.

Embedded capacitor PCB

 

YES

--

YES

--

YES

--

Surface Process

Lead-free HASL, ENIG, OSP, Immersion silver, Immersion tin,
 Flash gold, Gold finger plating,  Selective hard gold plating, 
Peelable solder mask, Carbon ink


O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs. Venessa

Send your inquiry directly to us
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