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26L HDI PCB, one stop provider of PCB & PCBA, Base materila withTachyon-100,high TG material, 5.7mm board thickness, Immersion Tin Printed circuit board ,boards with back drill
- Multilayer board, 26L HDI PCB,FR-4
- •Layer count: 26L
- •materials: Tachyon-100
- •Board thickness:5.7mm+/-10%mm
- •Board size:457.2*228.6mm
- •Special : 26L HDI PCB
- •No. of holes (pcs):450
- •line w/s:7/12mil
- •Impedance control. Y / N (Tol %):N
- •Surface Finishing:Immersion Tin
- •Solder Mask Silkscreen: Green SM + Coverlay
- •Panelisation:Dim X (mm):400;Dim Y (mm):1450;
- •Routing/Punching:CNC
|
Place of Origin |
Guang dong, China (Mainland) |
Brand Name |
O-Leading |
|
Base Material |
NPG-150N |
Copper Thickness |
1oz |
|
Min. Hole Size |
0.2mm |
Min. Line Width |
2.35mil |
|
Surface Finishing |
immersion gold |
Min. Line Spacing |
3mil |
|
applicable to |
Industry control |
character |
Industrial Control |
|
certificates |
ISO9001,UL,RoHS,SGS |
Q/CTN |
10PCS-100PCS |
|
weight |
0.01kg -5kg |
MOQ |
10pcs |
| Model Number | power bank pcb assembly pcba manufacturer | Board Thickness | 0.1-5mm |
| color | green | price | $0.1-$10 |
| desigh type | customer requirement | size | 0.01m3-10m3 |
Packaging & Delivery
|
Packaging Details |
16 years professional OEM client board manufacturer |
|
Delivery Detail |
7-12days |
Product Description
|
item |
2017 |
2018~2020 |
2021~2023 |
|||
|
Volume |
Sample |
Volume |
Sample |
Volume |
Sample |
|
|
Layer count |
32 |
42 |
38 |
44 |
42 |
48 |
|
Min Line/space (μm) |
50/50 |
40/45 |
40/45 |
40/40 |
35/40 |
35/35 |
|
Min drill hole |
0.15 |
0.10 |
0.15 |
0.10 |
0.15 |
0.10 |
|
Aspect ratio |
14:1 |
16:1 |
16:1 |
18:1 |
18:1 |
20:1 |
|
N+C+N |
4+C+4 |
5+C+5 |
5+C+5 |
6+C+6 |
5+C+5 |
6+C+6 |
|
Any layer interconnection |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
5+2+5 |
6+2+6 |
|
Plate filling via |
YES |
-- |
YES |
-- |
YES |
-- |
|
Min. core thickness (exclude copper) (μm) |
50 |
40 |
40 |
thirty |
40 |
thirty |
|
Min. Laser Drill diameter (μm) |
75 |
65 |
65 |
50 |
50 |
40 |
|
Via on buried |
YES |
-- |
YES |
-- |
YES |
-- |
|
Material |
FR4, Megtron, Nelco, Rogers, Heavy Copper, etc. |
|||||
|
Embedded capacitor PCB
|
YES |
-- |
YES |
-- |
YES |
-- |
|
Surface Process |
Lead-free HASL, ENIG, OSP, silver with immersion, tin of immersion, |
|||||
