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FR4 TG160 pcb factory china, Printed circuit board in china
- 1.PCB P/N:3837865
- 2.Material: FR4 TG160
- 3.Layer count: 4 layers
- 4.Board thickness: 1.6mm
- 5.Copper thickness: 1oz
- 6.Minimum drill size: 0.13mm
- 7.Minimum trace & gap: 0.13mm
- 8.Surface finish: Immersion gold
- 9.Special Technology:Automotive PCB Printed Circuit Board
- Competitive Advantage:
- 1.Good Pricin
- 2.No MOQ & Free Sample
- 3.Focus on low to medium volume production
- 4.Quick & On-time Delivery
- 5.Good quality & International Approvals
- 6.Great Customer Service
- 7.Diversified Shipping Method
- 8.Wide Range of PCB Supplying
- 9.One Stop Turnkey EMS Service, including material procurement, SMT and thru-hole assembly, Box build assembly
- 10.UL recognized and RoHS compliant
Welcome to O-leading |
Product Description |
COPPER PLATE HOLES MINIMUM .025 AVG, .020MIN.. HOLES MAY NOT BE PLUGGED
Pack with colorless transparent bubble film ,25PCS/ bag, put desiccant in flank, put humidity indicator card on top side
Place of Origin |
Guang dong, China (Mainland) |
Brand Name |
O-Leading |
Base Material |
FR-4,,Aluminum |
Copper Thickness |
0.5oz-5oz |
Min. Hole Size |
0.2mm |
Min. Line Width |
0.2mm |
Surface Finishing |
immersion gold ,OSP,lead free HASL |
Board Thickness |
0.1-5mm |
applicable to |
led,mobile phone,air conditioners,washing machines |
character |
Industrial Control pcb |
certificates |
ISO9001,UL,RoHS,SGS |
Q/CTN |
10PCS-100PCS |
weight |
0.01kg -5kg |
MOQ |
10pcs |
color | blue ,red ,green,black.yellow | Min. Line Spacing | 0.2mm |
Model Number | power bank pcb assembly pcba manufacturer | price | $0.1-$10 |
desigh type | client requirement | size | 0.01m3-10m3 |
Our Team |
Certifications |
Packaging & Delivery |
Process Capability |
Layer Count: 1Layer-32Layer
Finished copper thickness: 1/3oz-12oz
Min Line width/spacing internal: 3.0mil/3.0mil
Min Line width/spacing external: 4.0mil/4.0mil
Max Aspect Ratio: 10:1
Board thickness: 0.2mm-5.0mm
Max Panel size(inches): 635*1500mm
Minimum Drilled Hole Size: 4mil
PIated Hole Tolerance: +/-3mil
BIind/Buried Vias (AII Types): YES
Via Fill(Conductive,Non-Conductive): YES
Base Material: FR-4,FR-4high Tg.Halogen free material,Rogers,Aluminium base,Polyimide,
PCB Material: FR-4,CEM-1,CEM-3,Aluminum-based board
Max PCB size: 510x460mm
Min PCB size:50x50mm
PCB Thickness:0.5mm-4.5mm
Board thickness:0.5-4mm
Min Components size: 0201
Standard chip size component: 0603 and larger
Component max height:15mm
Min lead pitch: 0.3mm
Min BGA ball pitch:0.4mm
Placement precision: +/-0.03mm