5G and HDI Demand——Research on Global HDI PCB Market Structure
With the further development of 5G, electronic products such as smart phones, tablet computers, and wearable devices are becoming more intelligent, miniaturized, high-frequency, high-speed, and highly integrated, and the number of components on the PCB is also increasing significantly. At the same time, with the high-frequency and high-speed transmission of 5G smart products and the significant enhancement of functions, the requirements for the screen are getting larger and the resolution is getting higher and higher, and power consumption has become the key point. At present, there is no new technological breakthrough in the battery part. It can only continually reduce the space of the mobile phone's motherboard, which helps to reduce the size, total volume and volume of the mobile phone's motherboard.
When high integration and PCB space cannot be increased, PCB wiring is denser, wire width and spacing are reduced, aperture and center distance are reduced, and the thickness of the insulation layer is reduced. However, traditional HDI process capabilities are limited and difficult to meet. Therefore, Anylayer's arbitrary layer interconnect structure + SLP-type carrier board technology (mSAP), which has more stacked layers, smaller line spacing, and can carry more functional modules, becomes the best solution.
Smartphone technology development is dominated by Apple. Starting from iPhone 4, HDI Anylayer arbitrary layer interconnect technology has been used, iPhone 8 has used SLP class carrier technology (mSAP), and Samsung's Galaxy series released in 2019 also uses SLP carrier board process technology. . Starting in 2018, domestic leading mobile phones Huawei, OPPO, VIVO, and Xiaomi flagship machines all have HDI Anylayer interconnect technology.In 2019, Huawei launched the P30 Pro 5G version, VIVO iQOO 5G version, and OPPO Reno 5G version in the domestic market. Any layer interconnection + motherboard sandwich structure. It is estimated that Huawei will introduce SLP-type carrier technology in flagship machines in 2020, and global mobile phone manufacturers will follow closely in the future.
As the prosperity of the PCB industry improves and production capacity accelerates to China, while the industry's prosperity continues to rise, China's PCB share is rapidly increasing, from 14% in 2011 to 23% in 2018, while domestic PCB factories In 2019, we are actively starting to build HDI plants to expand high-end HDI production capacity. Due to heavy investment in HDI production lines, relatively high technical requirements, and environmental protection approval thresholds such as electroplating production lines, barriers to entry for HDI production lines, especially high-end The expansion of production lines needs to be prepared 1-2 years in advance, and it is impossible to form large-scale new capacity and release it in the short term.