How do printed circuit boards have to be stored and handled?

1,For printed circuit boards finished in Immersion Silver

1. Store in dry and clean place, to maximum temperature 25°C (we recommend 21ºC) and a maximum humidity of 60% (we recommend < 50%). Keep away from direct sunlight, and pollution sources with chlorides and sulphides.

2. Do not open the plastic bags if it is not imperative. In that case, must be carefully closed again.

3.Once removed the plastic wrapping, printed circuits boards should be handled with gloves.

4. They must be assembled before 12 months after the date of manufacture.

5.We advise, within 72 hours prior to the ensemble, a baking of 4 hours @ 135 °C to remove any moisture content that could have been acquired during the storage. In the case of circuits unwrapped for a period longer than a week, this baking is essential. It can be done with the circuits stacked, there is no need to be separated in rack and the wrapping must be previously removed. High moisture content in the printed circuits during the welding processes is the origin of some of the most serious problems of quality in the assemblies.

2,For printed circuit boards finished in Electroless Immersion Nickel Gold

1. Store in dry and clean place, to maximum temperature 25°C (we recommend 21ºC) and a maximum humidity of 60% (we recommend < 50%).

2. Do not open the plastic bags if it is not imperative. In that case, must be carefully closed again.

3. Once removed the plastic wrapping, printed circuits boards should be handled with gloves.

4. They must be assembled before 24 months after the date of manufacture.

5. We advise, within 72 hours prior to the ensemble, a baking of 4 hours @ 135 °C to remove any moisture content that could have been acquired during the storage. In the case of circuits unwrapped for a period longer than a week, this baking is essential. It can be done with the circuits stacked, there is no need to be separated in rack and the wrapping must be previously removed. High moisture content in the printed circuits during the welding processes is the origin of some of the most serious problems of quality in the assemblies.

3,For printed circuit boards finished in HAL Tin (Lead-free)

1. Store in dry and clean place, to maximum temperature 25°C (we recommend 21ºC) and a maximum humidity of 60% (we recommend < 50%).

2. Do not open the plastic bags if it is not imperative. In that case, must be carefully closed again.

3. They must be assembled before 18 months after the date of manufacture.

4. We advise, within 72 hours prior to the ensemble, a baking of 4 hours @ 135 °C to remove any moisture content that could have been acquired during the storage. In the case of circuits unwrapped for a period longer than a week, this baking is essential. It can be done with the circuits stacked, there is no need to be separated in rack and the wrapping must be previously removed. High moisture content in the printed circuits during the welding processes is the origin of some of the most serious problems of quality in the assemblies.

4,For printed circuit boards finished in Immersion Tin

1. Store in dry and clean place, to maximum temperature 25°C (we recommend 21ºC) and a maximum humidity of 60% (we recommend < 50%).

2.  Do not open the plastic bags if it is not imperative. In that case, must be carefully closed again.

3. They must be assembled before 6 months after the date of manufacture.

4.  We advise, within 72 hours prior to the ensemble, a baking of 2 hours @ 110 °C to remove any moisture content that could have been acquired during the storage. In the case of circuits unwrapped for a period longer than a week, this baking is essential. It can be done with the circuits stacked, there is no need to be separated in rack and the wrapping must be previously removed. High moisture content in the printed circuits during the welding processes is the origin of some of the most serious problems of quality in the assemblies.

5,For printed circuit boards finished in HAL Tin-Lead

1. Not suitable for products RoHS Compliant

2.  Store in dry and clean place, to maximum temperature 25°C (we recommend 21ºC) and a maximum humidity of 60% (we recommend < 50%).

3.  Do not open the plastic bags if it is not imperative. In that case, must be carefully closed again.

4. They must be assembled before 24 months after the date of manufacture.

5. We advise, within 72 hours prior to the ensemble, a baking of 4 hours @ 135 °C to remove any moisture content that could have been acquired during the storage. In the case of circuits unwrapped for a period longer than a week, this baking is essential. It can be done with the circuits stacked, there is no need to be separated in rack and the wrapping must be previously removed. High moisture content in the printed circuits during the welding processes is the origin of some of the most serious problems of quality in the assemblies.