Heat resistance refers to the ability of the PCB assembly Printed circuit board
to resist the thermal mechanical stress during the welding process. The heat resistance of the HDI plate is an important project for the reliability of HDI. The delamination mechanism in PCB heat resistance test generally includes the following aspects: (1) when temperature changes, (2) micro defects in test samples; (3) volatile matter test samples. These three aspects will cause the corresponding stratification. If you want to know more about HDI PCB manufacturer china, click china pcb manufacturer.