Analysis of Thermal Reliability Method of PCB
- Release on:2017-06-15
In general, the distribution of copper foil on the board is very complex and difficult to model accurately. Therefore, the modeling needs to simplify the shape of the wiring, as far as possible with the actual circuit board close to the ANSYS model circuit board on the electronic components can also be used to simulate modeling, such as MOS tube, integrated circuit blocks. The following is the pcb manufacturer to solve the thermal reliability of the circuit board method:
First, thermal analysis can help designers determine the electrical properties of the components on the board to help the designer determine whether the component or board will burn out due to high temperatures. Simple thermal analysis is only to calculate the average temperature of the circuit board, the complexity of the High Quality PCBs china will have a number of electronic devices to establish a transient model. The accuracy of the thermal analysis ultimately depends on the accuracy of the component power provided by the circuit board designer.
Weight and physical dimensions are important in many applications. If the actual power consumption of the components is small, the safety factor of the design may be too high, so that the design of the circuit board is based on the actual or non-conservative component power consumption Perform thermal analysis. In contrast (and more serious) is the thermal safety factor design is too low, that is, the actual operation of the component temperature than the analyst predicted to be higher, such problems generally by installing a cooling device or fan on the circuit board To cool to solve. These external accessories increase the cost, and extend the manufacturing time, adding fans to the design will also bring instability to the reliability of the factors, so the main circuit board instead of passive rather than passive cooling methods (such as natural convection, conduction and radiation Heat dissipation).
Second, the circuit board simplified modeling, modeling before the analysis of the main plate in the heating device which, such as MOS tube and integrated circuit blocks, these components in the work of most of the loss of power into heat. Therefore, the design of the main need to consider these devices. In addition, consider the circuit board substrate, as a wire coated copper foil. They are not only in the design of the role of conduction, but also play the role of conduction heat, the thermal conductivity and heat transfer area are relatively large circuit board is an indispensable part of electronic circuits, its structure from the epoxy resin substrate And a copper foil as a wire coating. The thickness of the epoxy resin substrate was 4 mm and the thickness of the copper foil was 0.1 mm. Copper thermal conductivity of 400W / (m ℃), while the thermal conductivity of epoxy resin is only 0.276W / (m ℃). Although the added copper foil is very thin and thin, but the heat has a strong guiding effect, which in the modeling can not be ignored.
As long as you do the above two points, the reliability of Cheapest PCB makers china will be better.