Apple opens the motherboard technology revolution. Where is the future of PCB manufacturers?
Apple has always been a technology leader in the mobile phone and even in the consumer electronics industry. Each technological innovation of Apple will have a significant impact on the industry chain. Last year, the iPhone 8/8P and iPhone X were released one after another, and they whipped up a "whirlwind" across the industry.
In terms of hardware technology, the biggest highlight of the iPhone 8/8P and iPhone X is the A11 bionic processor it brings. According to the microgrid, the A11 uses the TSMC InFoWLP technology used in the A10 processor, but the process is reduced from 16nm to 10nm, which is one of the important reasons for its small size and improved performance. It is worth noting that, in the motherboard corresponding to the 10nm process, it has revolutionized the PCB industry's fine line manufacturing technology mSAP (improved semi-additive method) into the PCB industry, or started a new round of motherboard revolution. .
In fact, this technology evolution of the motherboard also has a proper term: Substrate-Like PCB (SLP).
Nowadays, smart phones generally use HDI high-density interconnect boards as their PCB solutions. A small circuit board can carry a large number of chips and circuit components. However, with the further development of miniaturization of electronic products, HDI at any level has gradually failed to meet the requirements of manufacturers.
Compared to HDI, the class carrier board further shortens the line width. It is reported that the line width of the HDI is approximately 50 microns, while the specification of the class carrier board is 30 microns. At the same time, the accuracy of the carrier board is higher than that of the conventional HDI board(Pcb design in china), but the accuracy level cannot reach the IC carrier board. It is a product with a performance in between. Therefore, although the class carrier board is a PCB hard board, it can provide a platform for more sophisticated circuit components.
At present, the manufacturing method of the carrier board is based on the HDI technology using the mSAP (semi-additive method) process. It is understood that the mSAP technology is mainly aimed at the production dilemma of the traditional subtractive method, as well as the existing problems in the fine line production of the additive method. It is a unique production process that combines the package carrier board and the high-density interconnect technology. In general, the high-end HDI linewidth can be as small as approximately 40 microns, and the mSAP can be as small as 30 or 25 microns.