We must encourage innovation if the company is to remain competitive
There were many innovations in PCB materials and processes. The popularity is toward high frequency electronics that provide lower electrical losses and better operation voltages. The way forward for the PCB will more than likely involve six or higher layers of thin laminates. Discrete actives and passives will probably be embedded internal on the assembly providing high quality power distribution. Fiber optic transmission lines and backplanes will be present for specific applications. We are going to also likely see animations components offering greater power consumption and paper-based multi-layer printed circuit boards (P-PCBs), an even more environmentally friendly option.