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Technologies

Item

Standard

Advanced

Minimum Line/Spacing, Internal

3/3

3/3

Minimum Line/Spacing, External

4/4

3/3

Minimum Drilled Hole Size

8

6

Aspect Ratio (Thickness to Drill)

10:1

15:1

Annular Ring (Diameter over Drill)

10

8

Anti-pad (Diameter over Drill)

20

16

Plated Hole Tolerance

±3

±2

Minimum Dielectric Thickness

3

2

Maximum PCB Thickness (inches)

0.200

0.250

Thickness Tolerance (% of Thickness)

±10

±7

Maximum PCB Dimensions (inches)

16.0 X 22.0

30.0 X 44.0

 Fabricated Dimensions – NC Routing

±5 mils

±3 mils

Layer-to-Layer Registration Tolerance

±5

±3

Solder Mask Clearance, Per Side

2.0 mils

1.5 mils

Blind/Buried Vias (All Types)

yes

yes

Via Fill (Conductive, Non-Conductive)

yes

yes

 Inner Layers

 Standard

 Advance

 Minimum Core thickness

3 mils

2 mils

 Minimum Line width

4 mils

3 mils (H Oz copper)

 Minimum Spacing (Air gap)

4 mils

3 mils (H Oz copper)

 Minimum pad size

Drill size+10 mils

Drill Size+7 mils

 Minimum Anti Pad (planes)

Drill Size+20 mils

Drill Size+16 mils