Home > Category > Hot products > Multilayer PCB > Base Material Mid-Tg EM-370(5), used for 6L Memory bank, high frequency PCB, Au Plating + OSP, blind/buried via holes, Back drill, HDI PCBS, quickturn
Contact Us
TEL: + 86-13428967267

FAX: + 86-4008892163-239121  

          + 86-2028819702-239121

Email: sales@o-leading.com Contact Now
Certifications
New Products
Electronic album

Base Material Mid-Tg EM-370(5), used for 6L Memory bank, high frequency PCB, Au Plating + OSP, blind/buried via holes, Back drill, HDI PCBS, quickturn

Base Material Mid-Tg EM-370(5), used for 6L Memory bank, high frequency PCB, Au Plating + OSP, blind/buried via holes, Back drill, HDI PCBS, quickturn

  • Layer count: 6L  MLB
  • Materials:Mid-Tg  EM-370(5)
  • Board thickness:1.27+/-0.1mm
  • Finishing Size:151.20x287.60mm(1*9)
  • Min Line w/s:inn 75/75um; out 75/100um
  • Min drill size [FHS/DHS] :0.25/0.50mm
  • Surface finish: Au Plating + OSP
  • Other : HF 
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED

Pack with colorless transparent bubble film ,25 PCS/ bag, put desiccant in flank, put humidity indicator card on top side

Layer structure






Tag:
O-LEADING SUPPLY CHAIN

Tel:+86-0752-8457668

Contact Person:Mrs.Fancy

PDF Show:PDF

Send Inquiry
captcha